Semiconductor device
AssigneeNEC Corporation
InventorsYasuo Ohno, Nobuyuki Hayama, Kensuke Kasahara, Tatsuo Nakayama, Hironobu Miyamoto, Yuji Takahashi, Yuji Ando, Kohji Matsunaga, Masaaki Kuzuhara
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AssigneeNEC Corporation
InventorsYasuo Ohno, Nobuyuki Hayama, Kensuke Kasahara, Tatsuo Nakayama, Hironobu Miyamoto, Yuji Takahashi, Yuji Ando, Kohji Matsunaga, Masaaki Kuzuhara
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An object of the present invention is to improve, in a group III nitride semiconductor device, the productivity, the heat diffusion characteristic and the device performance in high-speed operation, and, therefor, in a group III nitride semiconductor device of the present invention, an epitaxial growth layer 13 of a group III nitride semiconductor with a buffer layer 12 laid under it is formed on a sapphire substrate 11 in which an A plane (an (11-20) plane) is set to be the principal plane, and thereon a gate electrode 16, a source electrode 15 and a drain electrode 17 are formed, wherein a thickness of the single crystalline sapphire substrate is specifically set to be 100 μm or less.
A semiconductor device which comprises a group III nitride semiconductor layer formed on a single crystalline sapphire substrate, a source electrode and a drain electrode formed apart from each other on the surface of said group III nitride semiconductor layer, and a gate electrode formed between said source electrode and said drain electrode;
A semiconductor device which comprises a group III nitride semiconductor layer formed on a single crystalline sapphire substrate, a source electrode, a drain electrode and pad electrodes thereof formed apart from one another on the surface of said group III nitride semiconductor layer, and a gate electrode formed between said source electrode and said drain electrode;
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