Using selective deposition to form phase-change memory cells
AssigneeIntel Corporation
InventorChien Chiang
Life of this patent
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Abstract
A phase-change memory cell may be formed by selectively depositing the lower electrode in the phase-change memory pore. Thereafter, an adhesion-promoting material may be selectively deposited on the selectively deposited lower electrode and the upper surface surrounding the pore. Through the use of selective deposition techniques, the adhesion-promoting material can be positioned where needed and the lower electrode may be defined in a fashion that may reduce shunting current, reduce device current requirements, and increase dynamic range in some embodiments.
Claims25
A method comprising:
- defining a pore of a phase-change memory;
- and
- selectively depositing a lower electrode in said pore.
A phase-change memory comprising:
- a substrate;
- an insulating layer over said substrate;
- a passage formed through said insulating layer;
- and
- a selectively deposited lower electrode formed in said passage.
A phase-change memory comprising:
- a substrate;
- an insulating layer over said substrate;
- a passage formed through said insulating layer;
- and
- a selectively deposited adhesion-promoting layer.
Dependencies are inferred from the claim text.