Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof

A dielectric-forming composition characterized by comprising:

• (A) composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are coated with a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material;
• and
• (B) a resin component constituted of at least one of a polymerizable compound and a polymer.

Aqueous dispersions for electrodeposition containing a dielectric-forming composition characterized by being capable of forming a dielectric with permittivity of 30 or greater and dielectric loss tangent of 0.1 or smaller by heating at a temperature of 500° C. or lower, and comprising:

• (A) composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are coated with a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material;
• and
• (B) a resin component constituted of at least one of a polymerizable compound and a polymer.

Ultrafine particle-resin composite particles characterized in that the ultrafine particle-resin composite particles comprises:

• (J) inorganic ultrafine particles with the average particle size of 0.1 μm or smaller;
• and
• (B) a resin component constituted of at least one of a polymerizable compound and a polymer, and part or all of the surfaces of said inorganic ultrafine particles (J) are coated with said resin components (B), and said ultrafine particle-resin composite particles contain 20% by weight or more of said inorganic ultrafine particles (J).