Laser processing device and laser processing method

Abstract

The present invention provides a laser machining apparatus in a simple structure which can properly carry out laser machining by irradiating a laser beam easily at a predetermined energy density to a machining-target site in a predetermined range, and in addition, which can be downsized and can be kept with easy maintenance and has enhanced durability. The apparatus includes: a semiconductor stack 1 comprising a plurality of semiconductor laser elements; and a controller for controlling emission of the laser beam emitted from each of the semiconductor laser elements. The semiconductor stack 1 is divided into a plurality of blocks B11, B12, B13, B14 in correspondence with the machining-target site of a work piece. The controller controls the irradiation of the laser beam from each of the blocks B11, B12, B13, B14 to be changeable in terms of time.

Dependencies are inferred from the claim text.