Back to results
US 2003/0150838 A1Published application
Dispersion for chemical mechanical polishing
AssigneeDegussa AG
InventorsWolfgang Lortz, Christoph Batz-Sohn, Gabriele Perlet, Werner Will
Life of this patent
Estimating the term…
Abstract
An aqueous dispersion is used in the chemical mechanical polishing of surfaces, particularly oxidic surfaces, such as silicon dioxide. The aqueous dispersion contains a powder of pyrogenically produced silicon dioxide doped with 0.01 and 3 wt. % aluminium oxide, relative to the total amount of powder, said powder having an average particle diameter in the dispersion of not more than 0.1 μm.
Claims16
An aqueous dispersion for chemical mechanical polishing, comprising:
- a powder of pyrogenically produced silicon dioxide doped with aluminum oxide;
- wherein said powder comprises between 0.01 and 3 wt. % of said aluminium oxide;
- based on a total amount of said powder;
- and
- wherein an average particle diameter of said powder in said dispersion is not more than 0.1 μm.
2 more elements
Dependencies are inferred from the claim text.