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US 2003/0150742 A1Published application
Processing a printed wiring board by single bath electrodeposition
AssigneeThe Regents of the University of California
InventorsMichael P. Meltzer, Christopher P. Steffani, Ray A. Gonfiotti
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Abstract
A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.
Claims7
A printed wiring board produced by the method of:
- implementing initial processing steps on said printed wiring board,
- plating Cu on said printed wiring board from a Ni/Cu bath,
- plating Ni on said printed wiring board from a Ni/Cu bath, and
- implementing final processing steps on said printed wiring board.
1 more element
Dependencies are inferred from the claim text.