Plasma processing apparatus
AssigneeTrikon Technologies Limited
InventorGordon Robert Green
Life of this patent
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Abstract
A sputter apparatus (10) includes a chamber (13a) housing a target (11), a work piece support (12) and a process area (14) between the target and the support. The apparatus further includes an inlet (24) for process gas and a pumping outlet (27) from the process area. The inlet substantially surrounds the support and the apparatus includes a pumping outlet separate from the inlet. The inlet is shielded from the process area.
Claims14
Sputter apparatus including:
- (a) a chamber;
- (b) a target;
- (c) a work piece support having a support surface;
- (d) a process area between the target and the work piece support;
- (e) an inlet for process gas;
- and
- (f) a pumping outlet from the process area,
- wherein the inlet substantially surrounds the support, the apparatus including a pumping outlet separate from the inlet and wherein the inlet is shielded from the process area.
Substrate processing apparatus including a chamber and a substrate support within the chamber and raisable and lowerable during operation characterised in that the substrate support has a constant cross-section portion and the chamber or an element thereon includes a projection for co-operating with the constant cross-section portion to define a fixed dimension gas outlet in all operative positions of the support.
Dependencies are inferred from the claim text.