Method and apparatus for coupling a microelectronic device package to a circuit board
OwnerChia-Pin Chiuinventor
Life of this patent
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Abstract
Multiple through holes in a printed circuit board (PCB) are filled with a malleable, electrically conductive material, such as an elastomer containing a concentration of conductive particles. The material in each through hole forms an electrical contact at which a solder ball or pin of a ball grid array (BGA) or pin grid array (PGA) of a microelectronic package, respectively, will be coupled to the PCB.
Claims25
A circuit board comprising:
- a substrate;
- a plurality of through holes in the substrate;
- and
- a malleable, electrically conductive material filled within each of the through holes.
A circuit board comprising:
- a substrate having a first surface and a second surface parallel to the first surface;
- and
- a plurality of tapered through holes in the substrate from the first surface to the second surface;
- each of the through holes filled with an electrically conductive elastomer to receive a separate one of a plurality of electrical contacts of an electronic component, to couple the electronic component to the circuit board.
An apparatus comprising:
- a circuit board including
- a substrate having a first surface and a second surface parallel to the first surface,
- a plurality of tapered through holes in the substrate from the first surface to the second surface, and
- an electrically conductive elastomer filling each of the through holes;
- and
- an electronic component coupled to the circuit board, the electronic component having a plurality of electrical contacts, each in physical and electrical contact with the elastomer in a separate one of the through holes.
A method of manufacturing a circuit board, the method comprising:
- creating a plurality of through holes in a circuit board substrate;
- and
- causing each of the through holes to be filled with a malleable, electrically conductive material.
A method of mounting an electronic component to a circuit board, the method comprising:
- aligning a plurality of electrical contacts of the electronic component with a corresponding plurality of electrical contacts of the circuit board, wherein each of the electrical contacts of the circuit board comprises a through hole in the circuit board filled with an electrically conductive elastomer;
- and
- placing the electrical contacts of the electronic component in contact with the electrical contacts of the circuit board.
A circuit board comprising:
- a substrate;
- and
- coupling means for removably coupling an electronic component to the substrate physically and electrically, without using a socket.
Dependencies are inferred from the claim text.