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AssigneeIbiden Co., Ltd.
InventorsMasaru Takada, Kiyotaka Tsukada, Hiroyuki Kobayashi, Hisashi Minoura, Yoshikazu Ukai, Mitsuhiro Kondo
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In production of a printed wiring board comprising innerlayer conductor circuits 161, 131 arranged among insulating layers 101˜103 and blind via-holes 141, 142 formed from an outermost surface of the insulating layer toward the innerlayer conductor circuit, an opening hole 160 is previously formed in a central portion of the innerlayer conductor circuit 161 located at the bottom of the blind via-hole 141, and laser beams are irradiated from the outermost surface of the insulating layer to form the blind via-holes 141, 142. Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits 131, 161 and the blind via-holes 141, 142.
A method of manufacturing a printed wiring board including at least two insulating layers made of a synthetic resin and an innerlayer conductor circuit arranged between the insulating layers, the method comprising:
A method of manufacturing a printed wiring board including at least two insulating layers made of a synthetic resin and an innerlayer conductor circuit arranged between the insulating layers, the method comprising forming a plurality of blind via-holes from an outermost surface toward the innerlayer conductor circuit and having different depths by successively irradiating a laser beam for every portion where the blind via-holes are to be formed, wherein a shallowest blind via-hole is formed as a standard hole by using a standard laser beam having an energy strength required for the formation of the standard hole, and forming the blind via-holes having deeper depths by irradiating the standard laser beam plural times.
A method of manufacturing a printed wiring board comprising forming an innerlayer conductor circuit on a surface of an innerlayer substrate, forming a black oxide film on a surface of the innerlayer conductor circuit, forming a second conductor circuit onto the innerlayer substrate through an insulating layer, irradiating a laser beam to form a via-hole ranging from an outer most surface of the insulating layer to the innerlayer conductor circuit, forming a metal plated film onto an inner wall face of the via-hole, and;
A printed wiring board comprising an insulating layer, an innerlayer conductor circuit arranged adjacent to the insulating layer and provided on its surface with a black oxide film and a via-hole extending from an outermost surface of the insulating layer to the innerlayer conductor circuit, wherein an exposed portion having no black oxide film is formed on the innerlayer conductor circuit in a position corresponding to the bottom of the via-hole.
A method of manufacturing a printed wiring board comprising arranging at least two insulating layers on an innerlayer conductor circuit, forming a via-hole so as to extend from an outermost surface of the insulating layer through the at least two insulating layers to the innerlayer conductor circuit, forming an inner metal plated film in the via-hole to electrically conduct the innerlayer conductor circuit to an outer conductor circuit arranged on the outermost surface, arranging an annular middle land having an opening hole so as to protrude into the inside of the via-hole, wherein the via-hole is a stepped via-hole consisting of an outer via-hole segment located outside the annular middle land and an inner via-hole segment located at the side of the innerlayer conductor circuit and having a diameter smaller than that of the outer via-hole segment and a stepped portion located at the annular middle land, and the inner metal plated film is a stepped plated film formed along inner wall faces of the outer via-hole segment and the inner via-hole segment, forming the via-hole by irradiating a laser beam from the outermost surface toward the innerlayer conductor circuit in which the laser beam is arrived to the innerlayer conductor circuit through the opening hole of the annular middle land and irradiated to a range required for forming the diameter of the outer via-hole segment, and forming the metal plated film is formed after the formation of the via-hole.
A method of manufacturing a printed wiring board including at least two insulating layers on an innerlayer conductor circuit, a via-hole extending from an outermost surface of the insulating layer through the at least two insulating layers to the innerlayer conductor circuit comprising forming the via-hole by irradiating a laser beam from the outermost surface toward the innerlayer conductor circuit in which the laser beam is arrived to the innerlayer conductor circuit through the opening hole of the annular dummy land, forming an inner metal plated film in the via-hole so as to electrically connect the innerlayer conductor circuit to an outer conductor circuit arranged on the outermost surface;
A printed wiring board comprising an insulating layer, an upper conductor circuit arranged on an upper surface of the insulating layer, a lower conductor circuit arranged on a lower surface of the insulating layer, a blind via-hole passing through the insulating layer between the upper conductor circuit and the lower conductor circuit and bottomed at the lower conductor circuit, a via-plated layer formed on an inner wall face of the blind via-hole so as to electrically connect the upper conductor circuit to the lower conductor circuit, and a flowing hole of a plating solution having a diameter smaller than the blind via-hole formed in the lower conductor circuit constituting the bottom of the blind via-hole.
A method of manufacturing a printed wiring board including an insulating layer, an upper conductor circuit arranged on an upper surface of the insulating layer, a lower conductor circuit arranged on a lower surface thereof, a blind via-hole passing through the insulating layer between the upper conductor circuit and the lower conductor circuit and bottomed at the lower conductor circuit and a via-plated layer formed on an inner wall face of the blind via-hole so as to electrically connect the upper conductor circuit to the lower conductor circuit, wherein a flowing hole of a plating solution having a diameter smaller than the blind via-hole is formed in the lower conductor circuit constituting the bottom of the blind via-hole, comprising forming the blind via-hole by irradiating a laser beam from the upper surface of the insulating layer toward the lower conductor circuit, forming the flowing hole of the plating solution in the lower conductor circuit through the laser beam in the formation of the blind via-hole, flowing a chemical plating solution in the blind via-hole and the flowing hole of the plating solution to form a chemical plated layer in the blind via-hole, and thereafter electroplating by flowing an electroplating solution to form the via-plated layer.
A method of manufacturing a printed wiring board including forming an electric conduction hole in the insulating substrate, forming an upper pattern on an upper surface of an insulating substrate in a peripheral edge of a portion forming the electric conduction hole, forming a lower pattern closing the portion for the formation of the electric conduction hole on a lower surface of the insulating substrate, forming a metal plated film on an inner wall face of the electric conduction hole by a chemical plating treatment and an electroplating treatment, wherein the electroplating treatment is carried out by applying a current having a current density of 0.8˜1.4 A/dm2 to a chemical plated film covering the inner wall face of the electric conduction hole at a state of immersing the insulating substrate in an electroplating bath.
A printed wiring board comprising an insulating substrate, a conductor pattern formed on a surface of the insulating substrate, a solder filling hole passing through the insulating substrate and arriving at an upper surface of the conductor pattern and a solder filled in the solder filling hole, wherein the insulating substrate includes fibers therein, and end portions of the fibers protrude from a wall face of the solder filling hole and encroach into the solder.
A method of producing a printed wiring board comprising forming a conductor pattern on a surface of an insulating substrate including fibers, irradiating a laser beam to a portion of the insulating substrate not covered with the conductor pattern toward the conductor pattern to form a solder filling hole at a state of protruding end portions of the fibers included in the inside of the insulating substrate from a wall face of the solder filling hole, and filling solder into the inside of the solder filling hole.
A printed wiring board comprising at least two insulating layers, an innerlayer conductor circuit between the insulating layers, a blind via-hole formed from an outermost surface toward the innerlayer conductor circuit, and a solder filled in the inside of the blind via-hole, wherein the blind via-hole has an uneven form at a section of its wall face.
A method of producing a printed wiring board, including at least two insulating layers, an innerlayer conductor circuit between the insulating layers, a blind via-hole formed from an outermost surface toward the innerlayer conductor circuit and having an uneven form at a section of its wall face, and a solder filled in the inside of the blind via-hole, comprising forming the blind via-hole by irradiating a laser beam, and;
A method of producing a printed wiring board including a mounting recess portion for mounting an electronic part, a conductor pattern, and a heat-sink plate arranged at the bottom of the mounting recess portion, characterized in that a conductor pattern is formed on an insulating substrate comprising:
Dependencies are inferred from the claim text.