Layout for noise reduction on a printed circuit board and connectors using it

A layout of a printed circuit board for noise reduction comprising:

• a plurality of footprints being mounting on an outer face of a substrate of the printed circuit board, every two of said footprints being a signal-based pair when every footprints are electrically connected with a corresponding conductor from an electrical device;
• a plurality of connecting conductive traces each being electrically connected to one footprint, portions of every trace extending along at least one intermediate layer located in the substrate of the printed circuit board for easiness to be electrically connected to other functional circuit of the printed circuit board;
• wherein
• each trace connected to a first chosen pair of footprints is relocated to have portion of them pass through an area of the intermediate layer vertically spaced from the location of one footprint of a second chosen pair on the outer face of the substrate and an expanded conductive footprint is formed over there to couple with the footprint it faces.

A connector assembly having at least two mating ports to be engaged with a mating connector respectively, comprising:

• a substrate having an electrical circuit layout on at least two insulated layers;
• electronic components being electrically mounted on the substrate, at least one electronic component being used for each of the mating ports and having at least first and second pairs of conductors inside, one conductors of the first pair being closely parallel to and cross talked with one conductor of the second pair;
• wherein
• said layout has two sets of footprints used to connect with the paired conductors from the electronic components of each mating port, and said two sets of footprints are located on a different insulated layer of the substrate respectively, the footprint connected with said one conductor of said first pair of the electronic component couples with one footprint of a third set which is electrically connected to the footprint where the other conductor of said second pair not cross talked with said one conductor of said first pair is connected.

A printed circuit board comprising:

• a substrate having at least two insulated layers;
• a plurality of footprints being mounting on one insulated layer of the substrate of the printed circuit board, every two of said footprints being a signal-based pair when every footprints are electrically connected with a corresponding conductor from an electrical device;
• a plurality of connecting conductive traces each being electrically connected to one footprint, the traces connected respectively to every footprint of one chosen pair being located on two different insulated layers;
• wherein
• said traces located on two different insulated layers are aligned with each other along a predetermined distance.

A printed circuit board having conductive traces arrangement for reducing cross-talk therebetween, including

• a substrate defining at least three mounting surfaces;
• a first conductive trace including first, second and third sections;
• a second conductive trace including first, second and third sections;
• a third conductive trace including first, second and third sections;
• and
• wherein the first section of the first, second and third conductive traces are all arranged in a common mounting surface;
• wherein the second section of the first conductive trace is arranged in a second mounting surface and in align with the first section of the second conductive trace;
• wherein the third section of the first conductive trace is align with the third section of the third conductive trace.

A printed circuit board comprising:

• first, second and third layers stacked one another;
• first, second, third and fourth traces side by side located on the first layer in sequence, said first trace and said fourth trace being a differential pair, and said second trace and said third trace being another differential pair;
• a fifth trace located on the second layer, vertically aligned with the first trace and electrically connected to the third trace for somewhat counterbalancing crosstalk between the first trace and the second trace generated around the first layer;
• and
• a sixth trace located on the third layer, vertically aligned with the fourth trace and electrically connected to the second trace for somewhat counterbalancing crosstalk between the third trace and the fourth trace generated around the first layer;
• wherein
• a distance between the first layer and the second layer is different from that between the first layer and the third layer, and a size of said fifth trace and that of the said sixth trace are dimensioned according to those distances.