Multilayer package for a semiconductor device
OwnerNoyan Kinayman, Richard Anderson +2inventors
InventorsNoyan Kinayman, Richard Anderson, Bernard A. Ziegner, Jean-Pierre Lanteri
Life of this patent
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Abstract
An integrated circuit package assembly includes an integrated circuit, and a plurality of layers sealably connectable to each other to form a package having a cavity sized and shaped to receive the integrated circuit. Each layer is formed of a respective material. Each respective material is suitable for use as a printed circuit board substrate. At least one of the plurality of layers is a substrate having contacts that are connectable to electrical contacts of the integrated circuit. A bottom one of the layers has a plurality of ball attach pads, electrically connected to the contacts of the substrate.
Claims28
A package for an integrated circuit, comprising:
- a plurality of layers sealably connectable to each other to form a package having a cavity sized and shaped to receive the integrated circuit, each layer being formed of a respective material, each respective material being suitable for use as a printed circuit board substrate,
- at least one of the plurality of layers being a substrate having contacts that are connectable to electrical contacts of the integrated circuit, and
- a bottom one of the layers having a plurality of ball attach pads, electrically connected to the contacts of the substrate.
An integrated circuit package assembly, comprising:
- an integrated circuit;
- and
- a plurality of layers sealably connectable to each other to form a package having a cavity sized and shaped to receive the integrated circuit, each layer being formed of a respective material, each respective material being suitable for use as a printed circuit board substrate,
- at least one of the plurality of layers being a substrate having contacts that are connectable to electrical contacts of the integrated circuit, and
- a bottom one of the layers having a plurality of ball attach pads, electrically connected to the contacts of the substrate.
A printed circuit board assembly, comprising:
- a printed circuit board having a circuit board substrate with circuit traces and a plurality of devices thereon, said plurality of devices including at least one integrated circuit package assembly that includes:
- an integrated circuit;
- and
- a plurality of layers sealably connectable to each other to form a package having a cavity sized and shaped to receive the integrated circuit, each layer being formed of a respective material, each respective material being of a type suitable for use in the circuit board substrate,
- at least one of the plurality of layers being a package substrate having contacts that are connectable to electrical contacts of the integrated circuit, and
- a bottom one of the layers having a plurality of ball attach pads, electrically connected to contacts of the circuit board substrate.
A method of making a package for an integrated circuit, comprising the steps of:
- (a) providing a plurality of layers, each formed of a respective material suitable for use as a printed circuit board substrate, at least one of the plurality of layers being a substrate having contacts that are connectable to electrical contacts of the integrated circuit, and
- (b) sealably connecting the plurality of layers to each other to form a package having a cavity sized and shaped to receive the integrated circuit, wherein a bottom one of the layers has a plurality of ball attach pads that are electrically connected to the contacts of the substrate.
Dependencies are inferred from the claim text.