Back to results
US 2003/0150604 A1Published application
Polymer with solder pre-coated fillers for thermal interface materials
AssigneeIntel Corporation
InventorsPaul A. Koning, Fay Hua, Carl L. Deppisch
Life of this patent
Estimating the term…
Abstract
A thermal interface material made of a binder material and a fusible filler.
Claims25
A thermal interface material, comprising:
- a binder material;
- and
- a fusible filler.
A thermal interface material, comprising:
- a polymer binder;
- a non-fusible particle filler;
- and
- a solder coating the particle filler, wherein the non-fusible particle filler has a thermal conductivity greater than a thermal conductivity of the solder coating.
1 more element
An assembly, comprising:
- a heat sink;
- a spreader plate;
- a die;
- a thermal interface material in between the die and the spreader plate;
- and the thermal interface material in between the spreader plate and the heat sink, where the thermal interface material comprises a polymer binder and a solder pre-coated onto a non-fusible particle filler.
2 more elements
Dependencies are inferred from the claim text.