Adhesively bonded chip-and wafer stacks
AssigneeInfineon Technologies AG
InventorsRecai Sezi, Andreas Walter
Life of this patent
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Abstract
The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).
Claims27
Use of poly-o-hydroxy amides of the following general formula (I) for adhesive bonding:
- 49
- where a and d independently of one another are 0 or 1, b=0-100, and c=0-100;
- where X if a or d=0, i.e., if X is attached to NH, has the following definition:
- —H, alkylcarbonyl, alkenylcarbonyl, cycloalkenylcarbonyl, arylcarbonyl, aralkylcarbonyl, aralkenylcarbonyl, aralkynylcarbonyl or heterocycloalkyl-carbonyl each unsubstituted or substituted, it being possible for the carbonyl group to be attached to the aromatic moiety, heterocycle, or alkyl, alkenyl or alkynyl group;
- and X if a or d=1, i.e., if X is attached to CO, has the following definition:
- hydroxy, substituted or unsubstituted alkoxy, alkenoxy, aryloxy, cycloalkenoxy, amino, alkylamino, alkenylamino, arylamino, arylalkenoxy, arylalkylamino;
- Y1 to Y4 independently of one another have the following definition:
- substituted or unsubstituted aryl, a substituted or unsubstituted polynuclear aromatic hydrocarbon compound, a substituted or unsubstituted fused ring system, or alkyl, alkenyl, alkynyl, aralkyl, aralkenyl, aralkynyl, heterocyclo or cycloalkenyl each unsubstituted or substituted;
- Z1 to Z3 have the following definition, where Z1 to Z3 can be identical to or different than one another:
- aryl, aralkyl, aralkenyl, aralkynyl, heteroaryl, a polynuclear aromatic hydrocarbon compound or a fused ring system each unsubstituted or substituted.
Use according to one or more preceding claims, characterized in that where X, if a or d=0, i.e., if X is attached to NH, is:
- 50
- where e=0-10;
- R3 is:
- —H, and also:
- —(CH2)k—CH3 (k=0-10) —(CF2)k—CF3 (k=0-10)
- 51
- W is:
- —H —CN —CH(CH3)2 —C(CH3)3—(CH2)e—CH3 —(CF2)e—CF3 —(CH2)e—CH3 —Q—(CF2)—CF3
- 52
- where e=0-10;
- and Q is:
- —O—, —S— or —NH—.
Use according to one or more of the preceding claims, characterized in that Y1 to Y4 independently of one another are:
- 54 55
- where Q is:
- —O—,—S— or —NH—;
- R1 is:
- —H, —CF3, —OH, —SH, —COOH, —N(R4)2, alkyl, aryl, heteroaryl, and also:
- 56
- where e=0-10;
- Q is:
- —O—, —S— or —NH—;
- R2 is:
- —O—, —CO—, —NR3—, —S—, —SO2—, —S2—, —CH—
- or:
- 57
- R3 is:
- —H , and also:
- —(CH2)k—CH3 (k=0-10) —(CF2)k—CF3 (k=0-10)
- 58
- and R4 is:
- alkyl having from 1 to 10 carbon atoms, aryl or heteroaryl.
Use according to one or more of the preceding claims for adhesively bonding the following materials and/or components made of the materials:
- aluminum, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zinc, steel, brass, palladium, silver, tin, tantalum, tungsten, platinum, gold, lead, carbon, including layers containing carbon and deposited by means of plasma, carbon fibers, silicon or germanium, and/or alloys or compounds of these materials such as silicon carbide, silicon nitride, silicon oxide, titanium nitride, tantalum nitride, silicon oxynitride, tungsten nitride, gallium arsenide, gallium nitride, gallium indium phosphite, indium-tin oxide and/or glasses, ceramics, glass ceramics, clayware, porcelain, stoneware and/or silicates.
Use according to claim 8 or 9 for adhesively bonding components or materials used in microelectronics and optoelectronics.
Use according to one or more of claims 8-10 for adhesively bonding chips and/or wafers.
Use according to one or more of claims 8-11 for adhesively bonding ceramics, glass ceramics, glasses, clayware, porcelain, stoneware and/or silicates or minerals, such as marble, basalt, limestone, granite and/or concrete.
Adhesive composition, characterized in that it comprises 10-45% by weight of a poly-o-hydroxy amide as defined in one of claims 1 to 7, 55-90% by weight of an organic solvent, and optionally 0.1-10% by weight of a crosslinker.
Dependencies are inferred from the claim text.