Method of conforming a film to a surface
Assignee3M Innovative Properties Company
InventorsMichael R. Kesti, Frank T. Sher, Stephen J. Aden, Ronald S. Steelman, John R. David
Life of this patent
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Abstract
Methods of applying film to substrates are provided wherein the film matingly conforms to the configuration of the substrate, including areas adjacent protrusions or depressions in the substrate. In certain embodiments, the film is punctured by a probe and a vacuum is applied to the probe in order to aspirate air and urge the film toward a position of compliance with the substrate. Optionally, the film is softened by heat in order to facilitate conformance with the shape of the substrate.
Claims42
A method of applying a film to a substrate comprising:
- providing a film having a layer of adhesive;
- placing the film on a substrate such that a portion of the adhesive layer is in contact with the substrate;
- selecting a region between the film and the substrate where the adhesive layer is not in contact with the substrate;
- providing an aperture in the film adjacent the detached region;
- and
- applying vacuum to the selected region through the aperture in order to aspirate air from the region and urge the film adjacent the detached region toward the substrate.
A method of conforming an adhesive film to a substrate comprising:
- providing a film having a layer of adhesive;
- placing the film on a substrate such that a portion of the adhesive layer is in contact with the substrate;
- selecting a detached section of said film;
- providing at least one aspirator probe;
- applying vacuum to at least one of the probes;
- urging at least one of the probes against the detached section of the film with sufficient pressure to form an aperture;
- and
- aspirating air from the space between the detached section of the film and the substrate in order to urge the detached section of the film toward said substrate.
Dependencies are inferred from the claim text.