Apparatus for fabricating a semiconductor device
AssigneeHitachi Kokusai Electric Inc.
InventorTomoharu Shimada
Life of this patent
Estimating the term…
Abstract
A semiconductor fabricating apparatus having a structure, which facilitates a loading and unloading operation of wafers while having a low effect by a high temperature during a heat treatment. The semiconductor fabricating apparatus includes a plurality of ring-shaped holder having brims and recessed portions, the brims for mounting the to-be-processed wafers thereon, thereby performing the required heat treatment. A tweezer plate of a wafer loading-transferring device is inserted onto the recessed portion or taken out therefrom, and the inserted tweezer plate is ascended or descended, so that the wafer can be inserted on the brims or taken out therefrom.
Claims9
An apparatus for fabricating a semiconductor device, comprising:
- a substrate processing chamber;
- and
- one or more substantially ring shaped holders, each holder including at least one major portion for supporting a circumference of a substrate when the substrate is mounted on the holder, and at least one recessed portion for interconnecting end parts of the major portion,
- wherein the recessed portion has a height difference with the major portion of the holder and the substrate is processed in the substrate processing chamber while the substrate is mounted on the holder.
Dependencies are inferred from the claim text.