Use of polybenzoxazoles (PBOS) for adhesion
AssigneeInfineon Technologies AG
InventorsAndreas Walter, Recai Sezi
Life of this patent
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Abstract
The present invention describes the use of polybenzoxazoles (PBOs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the polybenzoxazoles of the formula (I).
Claims27
Use of polybenzoxazoles (PBOs) of the following general formula (I) for adhesive bonding:
- 48
- where a=0 or 1, b=0-100, c=0-100 and d=0 or 1, where a=d;
- X, if a and d=0, is:
- —H, alkyl, alkenyl, cycloalkenyl, aryl, aralkyl, aralkenyl, aralkynyl or heterocycloalkyl each unsubstituted or substituted;
- X, if a and d=1, is:
- hydroxy, substituted or unsubstituted alkoxy, alkenoxy, aryloxy, cycloalkenoxy, amino, alkylamino, alkenylamino, arylamino, arylalkenoxy, arylalkylamino;
- Y1 to Y4 independently of one another have the following definition:
- substituted or unsubstituted aryl, a substituted or unsubstituted polynuclear aromatic hydrocarbon compound, a substituted or unsubstituted fused ring system, or alkyl, alkenyl, alkynyl, aralkyl, aralkenyl, aralkynyl, heterocyclo or cycloalkenyl each unsubstituted or substituted;
- Z1 to Z3 independently of one another have the following definition:
- aryl, aralkyl, aralkenyl, aralkynyl, heteroaryl, a polynuclear aromatic hydrocarbon compound or a fused ring system each unsubstituted or substituted.
Use according to one or more of the preceding claims, characterized in that Y1 to Y4 independently of one another are:
- 53 54
- where Q is:
- —O—, —S— or —NH—;
- R1 is:
- —H, —CF3, —OH, —SH, —COOH, —N(R4)2, alkyl, aryl, heteroaryl, and also:
- 55
- where Q is:
- —O—, —S— or —NH—;
- R2 is:
- —O—, —CO—, —NR3—, —S—, —SO2—, —S2—, —CH2—, or:
- 56
- R3 is:
- —H, and also:
- 57
- and R4 is:
- alkyl having from 1 to 10 carbon atoms, aryl or heteroaryl.
Use according to one or more of the preceding claims for adhesively bonding the following materials and/or components made of the materials:
- aluminum, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zinc, steel, brass, palladium, silver, tin, tantalum, tungsten, platinum, gold, lead, carbon, including layers containing carbon and deposited by means of plasma, carbon fibers, silicon or germanium, and/or alloys or compounds of these materials such as silicon carbide, silicon nitride, silicon oxide, titanium nitride, tantalum nitride, silicon oxynitride, tungsten nitride, gallium arsenide, gallium nitride, gallium indium phosphite, indium-tin oxide and/or glasses, ceramics, glass ceramics, clayware, porcelain, stoneware and/or silicates.
Use according to one or more of the preceding claims for adhesively bonding components or materials used in microelectronics and optoelectronics.
Use according to one or more of the preceding claims for adhesively bonding chips and/or wafers.
Use according to one or more of the preceding claims for adhesively bonding ceramics, glass ceramics, glasses, clayware, porcelain, stoneware and/or silicates or minerals, such as marble, basalt, limestone, granite and/or concrete.
Adhesive composition, characterized in that it comprises 5-40% by weight of a polybenzoxazole as defined in one of claims 1 to 7, 60-95% by weight of an organic solvent, and optionally 0.1-10% by weight of a crosslinker.
Dependencies are inferred from the claim text.