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US 2003/0149135 A1Published application
No-flow underfill encapsulant
AssigneeNational Starch and Chemical Investment Holding Corporation
InventorsPaul Morganelli, Anthony Debarros, Brian Wheelock, Jayesh Shah
Life of this patent
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Abstract
A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.
Claims39
A no-flow underfill encapsulant material comprising:
- a) one or more epoxy resins;
- b) one or more linear polyanhydride;
- and
- c) one or more catalysts,
- wherein the material is substantially free of non-linear polyanhydrides.
2 more elements
Dependencies are inferred from the claim text.