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US 2003/0148721 A1Published application
Polishing pads useful for endpoint detection in chemical mechanical polishing
AssigneeApplied Materials, Inc.
InventorsManoocher Birang, Boguslaw A. Swedek
Life of this patent
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Abstract
A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through the polishing pad. A polishing pad can have a polishing layer and a coil or ferromagnetic body secured to the polishing layer. Recesses can be formed in a transparent window in the polishing pad.
Claims9
A polishing pad, comprising:
- a polishing layer having a polishing surface;
- and
- a solid transparent window in the polishing layer, the transparent window having top surface that is substantially flush with the polishing surface and having a bottom surface with at least one recess formed therein.
A method of manufacturing a polishing pad, comprising:
- forming a recess in a bottom surface of a solid transparent window;
- installing the solid transparent window in a polishing layer so that a top surface of the solid transparent window is substantially flush with a polishing surface of the polishing pad.
Dependencies are inferred from the claim text.