Polishing head and chemical mechanical polishing apparatus including the same

A chemical mechanical polishing apparatus for manufacturing a semiconductor device, comprising:

• a polishing table capable of rotating at a predetermined speed, the polishing table being covered with a pad;
• a slurry supplying nozzle for supplying a slurry onto the pad of the polishing table;
• a polishing head, capable of rotating, for holding a wafer and pressing the wafer to the pad of polishing table while rotating, the polishing head having a retainer ring for securing the wafer;
• and
• a step height difference measuring device for measuring a height difference between the wafer and the retainer ring.

A chemical mechanical polishing apparatus for manufacturing a semiconductor device, comprising:

• a polishing table covered with a pad, the polishing table being capable of rotating at a predetermined speed;
• a slurry supplying nozzle for supplying slurry onto the pad of the polishing table;
• and
• a polishing head, including:
• a plate having a plurality of vacuum holes for transferring a vacuum pumping force;
• a porous film having a plurality of holes corresponding to the locations of the plurality of vacuum holes, the porous film being attached to a lower surface of the plate;
• a retainer ring attached to the lower surface of the plate at an edge portion thereof and having a sloped surface;
• a clamp ring attached to the lower surface of the plate adjacent the retainer ring for clamping the retainer ring;
• an adjusting ring having a sloped surface parallel and in contact with the sloped surface of the retainer ring, the adjusting ring being installed between the retainer ring and the plate;
• and
• a diameter adjusting device for adjusting a diameter of the adjusting ring by moving the adjusting ring along the sloped surface of the retainer ring, thereby adjusting a height of the retainer ring.