Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
AssigneesKabushiki Kaisha Toshiba, Ebara Corporation
InventorsKatsuya Okumura, Riichirou Aoki, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura
Life of this patent
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Abstract
A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
Claims19
A polishing apparatus for polishing a workpiece comprising:
- a reversing mechanism for reversing the workpiece to be polished;
- a loading position for placing the workpiece to be polished;
- a robot for transferring the workpiece from said reversing mechanism to said loading position;
- a turntable;
- and
- a top ring for holding the workpiece during the polishing;
- wherein said top ring transfers workpiece from said loading position to said turntable.
A method for polishing a workpiece comprising:
- introducing the workpiece interior of a polishing apparatus;
- transferring the workpiece in said polishing apparatus;
- reversing the workpiece during said transferring:
- placing the reversed workpiece on a loading position;
- transferring the workpiece by a top ring from said loading position to a turntable;
- polishing the workpiece on said turntable, during which the workpiece is held by said top ring;
- and
- washing the polished workpiece.
A polishing apparatus for polishing a workpiece comprising:
- a plurality of polishing units, each of said polishing units comprising:
- a turntable;
- a top ring provided for holding the workpiece;
- a loading position for receiving the workpiece to be polished;
- and
- a transfer mechanism for transferring the workpiece from outside of said polishing unit to each of said loading positions;
- wherein said top ring transfers the wafer from the loading position to the turntable.
A method for polishing and then washing a workpiece comprising:
- polishing the workpiece while the workpiece is held by a top ring;
- transferring the workpiece after said polishing by said top ring to a releasing position for releasing the workpiece from said top ring;
- washing the workpiece at said releasing position;
- releasing the workpiece at said releasing position from said top ring;
- washing said top ring, which releases the workpiece at said releasing position;
- transferring the workpiece to a primary washing station;
- carrying out a primary washing process for the workpiece;
- transferring the workpiece to a secondary washing station;
- and
- carrying out a secondary washing process for the workpiece.
A polishing apparatus for polishing and then washing a workpiece comprising:
- a polishing unit for polishing the workpiece;
- a top ring for holding the workpiece;
- a releasing position for releasing the workpiece from said top ring;
- a washing mechanism for washing the workpiece and the top ring which releases the workpiece;
- a washing unit comprising a plurality of washing stations for washing the polished workpiece;
- a transferring mechanism for transferring the workpiece from said releasing position to said washing unit;
- and
- another transferring mechanism for transferring the workpiece between said plurality of washing stations.
A polishing apparatus for polishing a workpiece comprising:
- a plurality of first polishing units;
- one second polishing unit, wherein said first polishing units require more time than said second polishing unit;
- and
- a washing unit for washing the workpiece polished by one of said first polishing units and said second polishing unit.
Dependencies are inferred from the claim text.