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US 2003/0148710 A1Published application
Method for removing a metallic layer of a layer-system
AssigneeSiemens Aktiengesellschaft
InventorsWinfried Esser, Ralph Reiche
Life of this patent
Estimating the term…
Abstract
A metallic layer is cooled below room temperature, leading to an embrittlement. Subsequently, the metallic layer is stripped by performing a blasting process having a high efficiency because of the brittleness. Additionally, the substrate is prevented from being damaged by using a comparatively low blasting energy.
Claims17
A method for removing a metallic layer of a layer-system including a substrate coated with the metallic layer, the method which comprises:
- cooling at least portions of the layer-system;
- and
- stripping at least portions of the metallic layer using a blasting process.
Dependencies are inferred from the claim text.