Method and apparatus of eddy current monitoring for chemical mechanical polishing
AssigneeApplied Materials, Inc.
InventorsManoocher Birang, Boguslaw A. Swedek, Hyeong Cheol Kim
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Abstract
A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through the polishing pad. A polishing pad can have a polishing layer and a coil or ferromagnetic body secured to the polishing layer. Recesses can be formed in a transparent window in the polishing pad.
Claims46
A polishing system, comprising:
- a polishing pad having a polishing surface;
- a carrier to hold a substrate against the polishing surface of the polishing pad;
- and
- an eddy current monitoring system including an induction coil positioned on a side of the polishing surface opposite the substrate, the induction coil extending at least partially through the polishing pad.
A polishing system, comprising:
- a polishing pad having a polishing surface;
- a carrier to hold a substrate against the polishing surface of the polishing pad;
- and
- an eddy current monitoring system including a ferromagnetic body positioned on a side of the polishing surface opposite the substrate, the ferromagnetic body extending at least partially through the polishing pad.
A polishing system, comprising:
- a polishing pad having a polishing surface and a backing surface with a recess formed therein;
- and
- an eddy current monitoring system including an induction coil positioned at least partially in the recess.
A polishing system, comprising:
- a polishing pad having a polishing surface and a backing surface with a recess formed therein;
- and
- an eddy current monitoring system including a ferromagnetic body positioned at least partially in the recess.
A carrier head for a polishing system, comprising:
- a substrate receiving surface;
- and
- a ferromagnetic body in the carrier head on a side opposite the substrate receiving surface.
A polishing pad, comprising:
- a polishing layer;
- and
- an induction coil secured to the polishing layer.
A polishing pad, comprising:
- a polishing layer;
- and
- a ferromagnetic body secured to the polishing layer.
A method of polishing, comprising:
- bringing a substrate into contact with a polishing surface of a polishing pad;
- positioning an induction coil on a side of the polishing surface opposite the substrate so that the induction coil extends at least partially through the polishing pad;
- causing relative motion between the substrate and the polishing pad;
- and
- monitoring a magnetic field using the induction coil.
A method of polishing, comprising:
- bringing a substrate into contact with a polishing surface of a polishing pad;
- positioning a ferromagnetic body on a side of the polishing surface opposite the substrate so that the ferromagnetic body extends at least partially through the polishing pad;
- eausing relative motion between the substrate and the polishing pad;
- and
- monitoring a magnetic field using an induction coil that is magnetically coupled to the ferromagnetic body.
Dependencies are inferred from the claim text.