Power electronics unit
AssigneeSiemens Aktiengesellschaft
InventorBernd Thyzel
Life of this patent
Estimating the term…
Abstract
The invention relates to a power electronics unit with a sheet-like carrier element, on which interconnects 5 are arranged for the electrical connection of electrical power components 6 and control components 7 of a circuit, likewise located on the carrier element. The carrier element is a heat sink 1, on which the interconnects 5 have been applied by means of a heat-conducting adhesive 3, and a minimum thickness of the heat-conducting adhesive 3 to allow the heat-conducting adhesive 3 to be an electrical insulating layer is ensured by spacers 4 in the heat-conducting adhesive 3.
Claims16
A power electronics unit, in particular for a device in a motor vehicle, with a sheet-like carrier element, on which interconnects are arranged for the electrical connection of electrical power components and control components of a circuit, likewise located on the carrier element, characterized in that the carrier element is a heat sink (1), on which the interconnects (5) have been applied by means of a heat-conducting adhesive (3), and a minimum thickness of the heat-conducting adhesive (3) to allow the heat-conducting adhesive (3) to be an electrical insulating layer is ensured by spacers (4) in the heat-conducting adhesive (3).
The power electronics unit as claimed in one of the preceding claims, characterized in that the heat sink is a housing component of a housing accommodating the power electronics.
The power electronics unit as claimed in one of the preceding claims, characterized in that the interconnects (5) are produced by punching out or etching out from a copper foil.
The power electronics unit as claimed in one of the preceding claims, characterized in that the spacers (4) are spherical.
The power electronics unit as claimed in one of the preceding claims, characterized in that the spacers (4) consist of an electrically and thermally insulating material.
A method of producing a power electronics unit as claimed in one of the preceding claims, characterized in that a pattern of interconnects (5) is produced from a copper foil by means of punching or etching and is applied by means of a heat-conducting adhesive (3) onto a sheet-like heat sink (1), in which spacers (4) are mixed in, in that the heat-conducting adhesive (3) is subsequently cured, with the pattern of interconnects (5) being pressed against the heat sink (1), and in that the power components (6) and control components (7) are thereafter inserted into the pattern of interconnects (5) and soldered.
The method as claimed in claim. 13, characterized in that the heat-conducting adhesive is printed onto the heat sink and the copper foil is subsequently applied onto the printed-on heat-conducting adhesive.
Dependencies are inferred from the claim text.