Wireless communications system and method of making
AssigneeMicron Technology, Inc.
InventorsKie Y. Ahn, Leonard Forbes
Life of this patent
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Abstract
A wireless communication system comprising a carrier having a top and a bottom surface, and a plurality of integrated circuit components for transmitting and receiving communication signals located on the top and bottom surfaces of the carrier. At least one passageway extends through the carrier, and conductive material extends through the passageway for electrically interconnecting the integrated circuit components located on the top and bottom surfaces of the carrier.
Claims51
A wireless communication system comprising:
- a carrier having a top and a bottom surface;
- a plurality of integrated circuit components for transmitting, receiving and processing wireless communication signals, said integrated circuit components being located on the top and bottom surfaces of said carrier;
- at least one passageway extending through said carrier;
- and
- conductive material extending through said passageway for electrically interconnecting said integrated circuit components located on the top and bottom surfaces of said carrier.
A wireless communication system comprising:
- a plurality of stacked carriers, each one of the carriers having a top and a bottom surface;
- a plurality of integrated circuit components for transmitting, receiving and processing RF wireless communication signals, said integrated circuit components being located on at least one of the top and bottom surfaces of the carriers;
- at least one passageway extending through at least one of the carriers;
- and
- at least one interconnect line extending through said passageway for electrically interconnecting integrated circuit components located on the surfaces of said carriers.
The method of forming a wireless communication system, said method comprising the steps of:
- providing a carrier having a top surface and a bottom surface;
- forming a hole through the carrier which extends between the top surface and the bottom surface;
- providing a plurality of integrated circuit components for transmitting, receiving and processing wireless communication signals on the top and bottom surfaces of said carrier;
- and
- filling the hole with conductive material to interconnect the integrated circuit components on the top and bottom surfaces of said carrier.
Dependencies are inferred from the claim text.