Method and production of a sensor
AssigneeMicronas GmbH
InventorsGunter Igel, Markus Rogalla
Life of this patent
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Abstract
The invention relates to a method for producing a sensor (1), wherein a carrier chip (2) is produced. Said chip is provided with a sensor structure (3) comprising an active sensor surface (4). A material (9) capable of flowing is applied onto carrier chips (2) in such a way that the sensor structure (3) has a thinner layer thickness on said active sensor surface (4) than on the area of the carrier chip (2) which borders on the active sensor surface (4). The material (9) which is capable of flowing is hardened thereafter. The hardened material (9) is subsequently removed by chemical means from the surface which faces said carrier chip (2) until the active sensor surface of the sensor structure is layed bare.
Claims7
A method for producing a sensor (1), such that a carrier chip (2) is produced, which has a sensor structure (3) with an active sensor surface (4), a flowable material (9) is applied to that surface region of the carrier chip (2), which bounds the active sensor surface (4), and this material (9) is then solidified, characterized in that the flowable material (9) is applied less thick on the active sensor surface (4) of the sensor structure (3) than on the region of the carrier chip (2), which surrounds the active sensor surface (4), and that, after the flowable material (9) has solidified, it is chemically ablated over its entire surface which faces away from the carrier chip (2), until the active sensor surface (4) of the sensor structure (3) is exposed.
Dependencies are inferred from the claim text.