Electrode connection method, electrode surface activation apparatus, electrode connection apparatus, connection method of electronic components and connected structure
AssigneeFujitsu Limited
InventorsKeishiro Okamoto, Masataka Mizukoshi, Yasuo Yamagishi
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Abstract
An electrode connecting method of connecting a first electrode and a second electrode is disclosed. The respective bonding surfaces of the first and second electrodes are activated. Then, each of the first and second electrodes having the activated surfaces is coated with a coating member for maintaining an activated state. A solid state bond between the first electrode and the second electrode is formed by pressure welding the first electrode and the second electrode so that the first and second electrodes break through the coating members.
Claims21
An electrode connecting method of connecting a first electrode and a second electrode, comprising the steps of:
- (a) activating respective bonding surfaces of the first and second electrodes;
- (b) coating each of the first and second electrodes having the activated bonding surfaces with a coating member for maintaining an activated state;
- and
- (c) forming a solid state bond between the first and second electrodes by pressure welding the first and second electrodes so that the first and second electrodes break through the coating members.
An electrode surface activation apparatus activating a surface of an electrode, comprising:
- a first apparatus activating a bonding surface of the electrode;
- and
- a second apparatus coating, with a coating member for maintaining the activated state, the electrode having the activated bonding surface.
An electrode connecting apparatus, comprising:
- an electrode surface activation apparatus;
- and
- a connecting apparatus,
- said electrode surface activation apparatus comprising:
- a first apparatus activating a bonding surface of an electrode;
- and
- a second apparatus coating, with a coating member for maintaining the activated state, the electrode having the activated bonding surface;
- wherein said connecting apparatus forms a solid state bond between a pair of electrodes by pressure welding the pair of electrodes so that the electrodes break through the coating members, each of the pair of electrodes having the bonding surface activated by said electrode surface activation apparatus.
A method of directly connecting components via respective electrodes, each component having an electrode and at least one of the components being an electronic component, comprising the steps of:
- (a) applying a metal material having Young's modulus of equal to or less than 50 GPa to a surface of the electrode of at least one of the components;
- (b) activating a surface of the metal material and a surface of the electrode of another component when the metal material is not applied to the surface of the electrode of the other component;
- and
- (c) connecting the components by forming a solid state bond between the respective electrodes of the components via the applied metal material.
A connected structure in which components are directly connected via respective electrodes and a metal material for bonding arranged between the electrodes, wherein the components are connected by a method comprising the steps of:
- (a) applying the metal material having Young's modulus of equal to or less than 50 GPa to a surface of the electrode of at least one of the components;
- (b) activating a surface of the metal material and a surface of the electrode of another component when the metal material is not applied to the surface of the electrode of the other component;
- and
- (c) connecting the components by forming a solid state bond between the respective electrodes of the components via the applied metal material.
Dependencies are inferred from the claim text.