BOC BGA package for die with I-shaped bond pad layout

A method of forming an integrated circuit die package, comprising the steps of:

• providing a mold containing a die unit;
• the mold having first and second molding plates, a molding chamber, and a mold gate through the first molding plate providing a conduit for flowing a molding compound into the chamber, the mold gate oriented perpendicular to the second molding plate;
• the die unit comprising a die having a first surface, a second surface, and sides;
• the first surface of the die comprising a plurality of bond pads disposed thereon, and being mounted onto a support substrate with the bond pads exposed through an opening of the support substrate;
• the die unit positioned within the mold such that the mold gate is oriented perpendicular to the opening in the support substrate of the die unit;
• and
• introducing a molding compound through the mold gate to flow the molding compound into the opening in the support substrate of the die unit.

A method of forming an integrated circuit die package, comprising the steps of:

• providing a mold containing a die unit;
• the mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• the die unit comprising a die having a first surface, a second surface, and sides;
• the first surface of the die comprising a plurality of bond pads disposed thereon, and being mounted onto a support substrate with the bond pads exposed through an opening of the support substrate, and a gap provided between a peripheral edge of the die and the opening of the support substrate;
• the die unit positioned within the mold such that the mold gate is oriented perpendicular to the opening in the support substrate of the die unit;
• and
• introducing a molding compound through the mold gate to flow the molding compound into the opening in the support substrate of the die unit to enclose the bond pads on the die.

A method of forming an integrated circuit die package, comprising the steps of:

• providing a mold containing a die unit;
• the mold having first and second molding plates, a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• the die unit comprising a die having a first surface, a second surface, and sides;
• the first surface of the die comprising a plurality of bond pads disposed thereon, and being mounted onto a support substrate with the bond pads exposed through an opening of the support substrate;
• the die unit positioned within the mold and the mold gate positioned in the first molding plate such that the mold gate is oriented perpendicular to the one end of the opening in the support substrate of the die unit;
• and
• introducing a molding compound through the mold gate to flow the molding compound into the one end of the opening in the support substrate of the die unit and from one end of the opening to the other end of the opening to enclose the bond pads on the die.

A method of forming an integrated circuit die package, comprising the steps of:

• providing a mold containing a die unit;
• the mold having first and second molding plates, a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• the die unit comprising a die having a first surface, a second surface, and sides;
• the first surface of the die comprising a plurality of bond pads disposed thereon, and being mounted onto a support substrate with the bond pads exposed through an opening of the support substrate;
• the die unit positioned within the mold and the mold gate positioned in the first molding plate such that the mold gate is oriented perpendicular to about the center of the opening in the support substrate of the die unit;
• and
• introducing a molding compound through the mold gate to flow the molding compound into about the center of the opening in the support substrate of the die unit and toward each end of the opening to enclose the bond pads on the die.

A method of forming an integrated circuit die package, comprising the steps of:

• providing a mold containing a die unit;
• the mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• the die unit comprising a die and a support substrate, the die having a first surface, a second surface, and sides, the first surface of the die comprising a plurality of bond pads disposed thereon;
• the support substrate having a hole therethrough;
• and the die being mounted onto the support substrate with the bond pads exposed through an opening of the support substrate and the hole through the substrate uncovered;
• the die unit positioned within the mold such that the mold gate is oriented perpendicular to the opening in the support substrate of the die unit;
• and
• introducing a molding compound through the mold gate to flow the molding compound into the opening in the support substrate of the die unit and through the hole in the substrate to enclose the bond pads and the sides of the die.

A method of forming an integrated circuit die package, comprising the steps of:

• providing a mold containing a die unit;
• the mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• the die unit comprising a die having a first surface, a second surface, and sides;
• the first surface of the die comprising a plurality of bond pads disposed thereon in an I-shaped layout, and being mounted onto a support substrate with the bond pads exposed through an I-shaped opening of the support substrate;
• the die unit positioned within the mold such that the mold gate is oriented perpendicular to the opening in the support substrate of the die unit;
• and
• introducing a molding compound through the mold gate to flow the molding compound into the opening in the support substrate of the die unit to enclose the bond pads on the die.

A method for encapsulating an integrated circuit die, comprising the steps of:

• providing a mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• providing a die unit comprising a die having a first surface, a second surface, and sides;
• the first surface of the die having a plurality of bond pads disposed thereon, the first surface of the die mounted onto a support substrate with the bond pads exposed through an opening of the support substrate;
• placing the die unit in the mold with the mold gate oriented perpendicular to the first surface of the die;
• and
• introducing a molding compound through the mold gate whereby the molding compound flows into the opening in the support substrate to enclose the bond pads on the die.

A method for encapsulating an integrated circuit die, comprising the steps of:

• providing a mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• providing a die unit comprising a die having a first surface, a second surface, and side surfaces;
• the first surface of the die having a plurality of bond pads disposed thereon;
• the first surface of the die mounted onto a support substrate with the bond pads exposed through an opening of the support substrate, and a gap provided between a peripheral edge of the die and the opening of the support substrate;
• placing the die unit in the mold with the mold gate oriented perpendicular to opening of the support substrate and the first surface of the die;
• and
• introducing a molding compound through the mold gate to flow the molding compound into the opening of the support substrate to enclose the bond pads on the die, and through the gap onto the sides of the die.

A method for encapsulating an integrated circuit die, comprising the steps of:

• providing a die comprising a first surface, a second surface, and opposing sides;
• the first surface with electrical elements and a plurality of bond pads disposed thereon, the bond pads in an I-shaped layout on the first surface;
• mounting the first surface of the die onto a support substrate with the bond pads exposed through an opening of the support substrate;
• the opening being I-shaped;
• electrically connecting the bond pads through the opening to bond pad fingers mounted on the support substrate adjacent to the opening to form a die unit;
• providing a mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• placing the die unit in the mold with the mold gate oriented perpendicular to the opening of the support substrate of the die unit;
• and
• introducing a molding compound through the mold gate to flow the molding compound into the opening of the support substrate to enclose the electrical elements and bond pads on the first surface of the die unit.

A method for encapsulating an integrated circuit die, comprising the steps of:

• providing a mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• providing a die comprising a first surface and a second surface, the first surface with electrical elements and a plurality of bond pads disposed thereon;
• providing a support substrate comprising an opening, a plurality of bond pad fingers disposed on a side of the substrate adjacent to the opening, and a plurality of ball pads disposed on the substrate adjacent to the bond pad fingers;
• mounting the die onto the support substrate to align and expose the plurality of bond pads through the opening of the support substrate;
• electrically connecting the bond pads through the opening to the bond pad fingers on the support substrate to provide a die unit;
• providing a mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• placing the die unit in the mold with the mold gate oriented perpendicular to the opening in the substrate and the first surface of the die;
• and
• introducing a molding compound through the mold gate whereby the molding compound flows directly into the opening in the support substrate to enclose the bond pad fingers and the electrical elements of the die.

A method for encapsulating an integrated circuit die, comprising the steps of:

• providing a mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• providing a die comprising a first surface, a second surface, and sides;
• the first surface with electrical elements and a plurality of bond pads disposed thereon;
• providing a support substrate having an I-shaped opening comprising a main elongate segment and a pair of shorter elongate segments positioned perpendicular to and on opposing ends of the main segment;
• a plurality of bond pad fingers disposed on a side of the substrate adjacent to the opening, and a plurality of ball pads disposed on the substrate adjacent to the bond pad fingers;
• mounting the die onto the support substrate to align the bond pads within the I-shaped opening of the support substrate, and provide a gap along a peripheral edge of the die and an edge of at least one of the shorter elongate segments of the opening in the support substrate;
• electrically connecting the bond pads through the opening to the bond pad fingers on the support substrate;
• providing a mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• placing the mounted die in the mold with the mold gate oriented perpendicular to the opening in the substrate;
• and
• introducing a molding compound through the mold gate to flow the molding compound into the opening into the substrate to enclose the bond pad fingers and the electrical elements of the die, and through the gap to enclose the sides of the die.

A method for encapsulating an integrated circuit die, comprising the steps of:

• providing a mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• providing a die comprising a first surface, a second surface, and sides;
• the first surface with electrical elements and a plurality of bond pads disposed thereon;
• providing a support substrate having an I-shaped opening comprising a main elongate segment and a pair of shorter elongate segments positioned perpendicular to and on opposing ends of the main segment;
• a plurality of bond pad fingers disposed on a side of the substrate adjacent to the opening, and a plurality of ball pads disposed on the substrate adjacent to the bond pad fingers;
• mounting the die onto the support substrate to align the bond pads within the I-shaped opening of the support substrate, and provide a gap along a peripheral edge of the die and an edge of at least one of the shorter elongate segments of the opening of the support substrate;
• electrically connecting the bond pads through the opening to the bond pad fingers on the support substrate;
• providing a mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• placing the mounted die in the mold with the mold gate oriented perpendicular to the opening of the support substrate;
• and
• introducing a molding compound through the mold gate to flow the molding compound into the opening of the substrate to enclose the bond pad fingers and the electrical elements of the die, and through the gap to enclose the sides of the die.

A method for encapsulating an integrated circuit die, comprising the steps of:

• providing a mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• providing a die comprising a first surface, a second surface, and sides;
• the first surface with electrical elements and a plurality of bond pads formed thereon;
• providing a support substrate having an I-shaped opening comprising a main elongate segment and a pair of shorter elongate segments positioned perpendicular to and on opposing ends of the main segment;
• a hole through the support substrate on opposite ends of and adjacent to the shorter elongate segments of the I-shaped opening;
• a plurality of bond pad fingers formed on a side of the substrate adjacent to the opening, and a plurality of ball pads formed on the substrate adjacent to the bond pad fingers;
• mounting the die onto the support substrate to align the bond pads within the I-shaped opening of the support substrate such that the holes through the support substrate are uncovered;
• electrically connecting the bond pads through the opening to the bond pad fingers on the support substrate;
• providing a mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• placing the mounted die in the mold with the mold gate oriented perpendicular to the opening in the support substrate;
• and
• introducing a molding compound through the mold gate to flow the molding compound directly into the opening of the substrate to enclose the bond pad fingers and the electrical elements of the die, and through the hole in the substrate onto the sides of the die.

A method for encapsulating an integrated circuit die, comprising the steps of:

• providing a mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• providing a die comprising a first surface, a second surface, and sides;
• the first surface with electrical elements and a plurality of bond pads formed thereon;
• providing a support substrate having an I-shaped opening comprising a main elongate segment and a pair of shorter elongate segments positioned perpendicular to and on opposing ends of the main segment;
• a hole through the support substrate on opposite ends of and adjacent to the shorter elongate segments of the I-shaped opening;
• a plurality of bond pad fingers formed on a side of the substrate adjacent to the opening, and a plurality of ball pads formed on the substrate adjacent to the bond pad fingers;
• mounting the die onto the support substrate to align the bond pads within the I-shaped opening of the support substrate such that the holes through the support substrate are uncovered, and a gap is provided along a peripheral edge of the die and an edge of at least one of the shorter elongate segments of the opening of the support substrate;
• electrically connecting the bond pads through the opening to the bond pad fingers on the support substrate;
• providing a mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• placing the mounted die in the mold with the mold gate oriented perpendicular to the opening in the support substrate;
• and
• introducing a molding compound through the mold gate to flow the molding compound into the opening of the substrate to enclose the bond pad fingers and the electrical elements of the die, and through the gap and the hole in the substrate onto the sides of the die.

A method for encapsulating an integrated circuit die, comprising the steps of:

• providing a mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• providing a die unit having a die comprising a first surface, a second surface, and sides, the first surface with electrical elements and a plurality of bond pads formed thereon;
• the first surface of the die mounted onto a support substrate with the bond pads exposed through an opening of the support substrate;
• placing the die unit in the mold with the mold gate oriented perpendicular to the opening in the support substrate;
• and
• introducing a molding compound through the mold gate whereby the molding compound flows in a downward direction into the opening in the substrate to enclose the electrical elements and bond pads on the die.

A method for encapsulating an integrated circuit die, comprising the steps of:

• providing a mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• providing a die unit comprising a die having a first surface, a second surface, and sides, the first surface of the die with electrical elements and a plurality of bond pads formed thereon, and the first surface of the die mounted onto a support substrate with the bond pads exposed through an opening of the support substrate;
• placing the die unit in the mold with the mold gate oriented perpendicular to opening in the support substrate;
• and
• introducing a molding compound through the mold gate whereby the molding compound flows in an upward direction into the opening in the substrate to enclose the electrical elements and bond pads on the die.

A method for encapsulating an integrated circuit die, comprising the steps of:

• providing a mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• providing a die unit comprising a die having a first surface, a second surface, and sides, the first surface with electrical elements and a plurality of bond pads disposed thereon;
• the first surface of the die mounted onto a support substrate with the bond pads exposed through an opening of the support substrate;
• placing the die unit in the mold with the mold gate oriented perpendicular to the opening in the support substrate and positioned at about the center of the opening;
• and
• introducing a molding compound through the mold gate to flow the molding compound into the opening of the support substrate at or about the center of the opening and toward each end of the opening to enclose the electrical elements and bond pads on the die.

A method for encapsulating an integrated circuit die, comprising the steps of:

• providing a mold having a molding chamber and a mold gate providing a conduit for introducing a molding compound into the chamber;
• providing a die unit comprising a die having a first surface, a second surface, and sides;
• the first surface of the die with electrical elements and a plurality of bond pads formed thereon;
• the first surface of the die mounted onto a support substrate with the bond pads exposed through an opening of the support substrate;
• placing the die unit in the mold with the mold gate oriented perpendicular to the opening in the support substrate and positioned at one end of the opening;
• and
• introducing a molding compound through the mold gate to flow the molding compound into the opening in the substrate and from one end of the opening to the other end to enclose the electrical elements and bond pads on the die.

A mold for encapsulating a semiconductor die, comprising:

• first and second molding plates, a chamber, and a mold gate providing a conduit for introducing a molding compound into the chamber;
• a die unit comprising a die having a first surface, a second surface, and sides;
• the first surface of the die with a plurality of bond pads disposed thereon;
• the first surface of the die mounted onto a support substrate with the bond pads exposed through an opening of the support substrate;
• and
• the die unit positioned in the mold with the mold gate oriented perpendicular to the opening in the support substrate.

A mold for encapsulating a semiconductor die, comprising:

• first and second molding plates, a chamber, and a mold gate providing a conduit for introducing a molding compound into the chamber;
• a die unit comprising a die having a first surface, a second surface, and sides;
• the first surface of the die with a plurality of bond pads thereon;
• the first surface of the die mounted onto a support substrate with the bond pads exposed through an opening of the support substrate;
• and
• the die unit positioned in the mold with the mold gate oriented perpendicular to the opening in the support substrate, and the die and mold gate oriented to allow a molding compound introduced through the mold gate to flow into the opening in the support substrate in a downward direction.

A mold for encapsulating a semiconductor die, comprising:

• first and second molding plates, a chamber, and a mold gate providing a conduit for introducing a molding compound into the chamber;
• a die unit comprising a die having a first surface, a second surface, and sides;
• the first surface of the die with a plurality of bond pads disposed thereon, the first surface of the die mounted onto a support substrate with the bond pads exposed through an opening of the support substrate;
• and
• the die unit positioned in the mold with the mold gate oriented perpendicular to the opening in the support substrate and the die and mold gate oriented to allow a molding compound introduced through the mold gate to flow directly onto the first surface of the die in an upward direction.

A mold for encapsulating a semiconductor die, comprising:

• first and second molding plates, a chamber, and a mold gate providing a conduit for introducing a molding compound into the chamber;
• a die unit comprising a die having a first surface, a second surface, and sides;
• the first surface of the die with a plurality of bond pads disposed thereon;
• the first surface of the die mounted onto a support substrate with the bond pads exposed through an opening of the support substrate;
• and
• the die unit positioned in the mold with the mold gate oriented perpendicular to the opening in the support substrate, and positioned on the mold to dispense a molding compound directly into one end of the opening.

A mold for encapsulating a semiconductor die, comprising:

• first and second molding plates, a chamber, and a mold gate providing a conduit for introducing a molding compound into the chamber;
• a die unit comprising a die having a first surface, a second surface, and sides;
• the first surface of the die with a plurality of bond pads disposed thereon;
• the first surface of the die mounted onto a support substrate with the bond pads exposed through an opening of the support substrate;
• and
• the die unit positioned in the mold with the mold gate oriented perpendicular to the opening in the support substrate, and positioned on the mold to dispense a molding compound into about the center of the opening.

A semiconductor assembly, comprising:

• a semiconductor die having a first surface, a second surface, and sides;
• the first surface having a plurality of bond pads disposed thereon in an I-shaped layout;
• and
• a support substrate having a first side, a second side, and an I-shaped opening corresponding to the layout of the bond pads, a plurality of bond pad fingers disposed on the first side of the support substrate and adjacent to the opening;
• the first surface of the die mounted onto the second side of the support substrate with the bond pads exposed through the opening of the support substrate and connected to the bond pad fingers.

A semiconductor package, comprising:

• a semiconductor die mounted on a support substrate;
• the die having a first surface, a second surface, and sides, and a plurality of bond pads mounted in an I-shaped layout on the first surface of the die;
• the support substrate having a first side, a second side, an I-shaped opening, a plurality of bond pad fingers mounted on the first side of the support substrate and adjacent to the opening;
• the first surface of the die mounted onto the second side of the support substrate with the bond pads exposed through the opening of the support substrate and connected to the bond pad fingers;
• and the bond pads on the die covered by a molding compound.

A semiconductor package, comprising:

• a semiconductor die mounted on a support substrate;
• the die having a first surface, a second surface, and sides, and a plurality of bond pads mounted in an I-shaped layout on the first surface of the die;
• the support substrate having a first side, a second side, an I-shaped opening, a plurality of bond pad fingers mounted on the first side of the support substrate and adjacent to the opening;
• the first surface of the die mounted onto the second side of the support substrate with the bond pads exposed through the opening of the support substrate and connected to the bond pad fingers;
• and the bond pads and the sides of the die are covered by the molding compound, and the second surface of the die is uncovered.

A semiconductor package, comprising:

• a semiconductor die mounted on a support substrate;
• the die having a first surface, a second surface, and sides, and a plurality of bond pads mounted in an I-shaped layout on the first surface of the die;
• the support substrate having a first side, a second side, an I-shaped opening, a plurality of bond pad fingers mounted on the first side of the support substrate and adjacent to the opening;
• the first surface of the die mounted onto the second side of the support substrate with the bond pads exposed through the opening of the support substrate and connected to the bond pad fingers;
• and the bond pads, the sides and the second surface of the die are covered by the molding compound.

A semiconductor package, comprising:

• a semiconductor die mounted on a support substrate;
• the die having a first surface, a second surface, and sides, and a plurality of bond pads mounted in an I-shaped layout on the first surface of the die;
• the support substrate having a first side, a second side, an I-shaped opening, a plurality of bond pad fingers mounted on the first side of the support substrate and adjacent to the opening;
• the first surface of the die mounted onto the second side of the support substrate with the bond pads exposed through the opening of the support substrate and connected to the bond pad fingers, and a gap between a peripheral edge of the die and the opening of the support substrate;
• and the bond pads on the die covered by a molding compound.

A semiconductor package, comprising:

• a semiconductor die mounted on a support substrate;
• the die having a first surface, a second surface, and sides, and a plurality of bond pads mounted in an I-shaped layout on the first surface of the die;
• the support substrate having a first side, a second side, an I-shaped opening, a hole adjacent the opening through the substrate, and a plurality of bond pad fingers mounted on the first side of the support substrate and adjacent to the opening;
• the first surface of the die mounted onto the second side of the support substrate with the bond pads exposed through the opening of the support substrate and connected to the bond pad fingers, and the hole providing a passage through the support substrate;
• and the bond pads on the die covered by a molding compound.

A semiconductor package, comprising:

• a semiconductor die mounted on a support substrate;
• the die having a first surface, a second surface, and sides, and a plurality of bond pads mounted in an I-shaped layout on the first surface of the die;
• the support substrate having a first side, a second side, an I-shaped opening, a hole adjacent the opening through the substrate, and a plurality of bond pad fingers mounted on the first side of the support substrate and adjacent to the opening;
• the first surface of the die mounted onto the second side of the support substrate with the bond pads exposed through the opening of the support substrate and connected to the bond pad fingers, the hole providing a passage through the support substrate;
• and a gap between a peripheral edge of the die and the opening of the support substrate;
• and the bond pads on the die covered by a molding compound.