Method of manufacturing cof package
AssigneeToray Engineering Co., Ltd.
InventorsMasanori Akita, Toshihiro Mori, Koji Ito
Life of this patent
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Abstract
A method of manufacturing a COF package comprises the steps of providing a resin film substrate with a hole for receiving a chip, providing an IC chip having electrodes, inserting the IC chip into the hole so as to fix it with its electrodes exposed above the substrate surface, and forming a circuit pattern on the substrate surface for connection with the electrodes. The hole and the IC chip are tapered, and the IC chip is secured in the hole with sealant or adhesive.
Claims8
A method of manufacturing a COF package, comprising the steps of providing a resin film substrate having a chip mounting hole, providing an IC chip having electrodes, inserting said IC chip into said chip mounting hole so as to fix it with its electrodes exposed above a surface of said substrate, and forming a circuit pattern on the substrate surface for connection with said electrodes, wherein said chip mounting hole and said IC chip are tapered, and said IC chip is fixed into said chip mounting hole with a sealant or an adhesive.
Dependencies are inferred from the claim text.