Packaged semiconductor device and method of formation
AssigneeFreescale Semiconductor, Inc.
InventorsMark A. Gerber, Shawn M. O'Connor, Trent A. Thompson
Life of this patent
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Abstract
A packaged semiconductor device (20) has a first integrated circuit die (28) having a top surface with active electrical circuitry implemented thereon. The first die (28) is mounted in a cavity (21) of a first heat spreader (22). A second die (36) having electrical circuitry implemented on a top surface is attached to the top surface of the first die (28). Both of the die (28 and 36) are electrically connected to a substrate (24) mounted on the first heat spreader (22). A second heat spreader (40) is mounted on the top surface of the second die (36). The second heat spreader (40) provides an additional path for thermal dissipation of heat generated by the second die (36).
Claims25
A method for forming a semiconductor device, comprising:
- providing a package device having a first heat spreader, a package substrate overlying the first heat spreader, and a cavity extending through the package substrate and into the first heat spreader;
- attaching a first die to the first heat spreader within the cavity;
- attaching a second heat spreader to the first die;
- forming a plurality of electrical connections between the first die and the package substrate;
- and
- encapsulating the electrical connections, the first die, and at least a portion of the second heat spreader.
A semiconductor device, comprising:
- a first heat spreader;
- a cavity extending into the first heat spreader;
- a first semiconductor die within the cavity;
- and
- a second heat spreader overlying the first semiconductor die.
A semiconductor device, comprising:
- a semiconductor die having a first surface and a second surface, the semiconductor die comprising active circuitry within the first surface;
- and
- a heat spreader connected to the first surface of the semiconductor die.
Dependencies are inferred from the claim text.