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AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsTakuya Yamamoto, Takashi Kataoka, Yutaka Hirasawa, Naotomi Takahashi
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The purpose is to provide a surface treated copper foil and an electrodeposited copper foil with carrier to be employed for a copper clad laminate capable to be processed for simultaneous hole formation in the copper foil layer and a substrate resin layer using carbon dioxide gas laser. The purpose can be achieved by using a surface treated copper foil bearing a nickel layer or a cobalt layer with a prescribed thickness in one side of a copper foil or an electrodeposited copper foil with carrier provided with a nickel layer or a cobalt layer with a prescribed thickness between a carrier foil and an electrode posited copper foil layer. When a copper clad laminate is manufactured using these foils, the copper clad laminate is capable to be processed to easily and simultaneously form a hole in the copper foil layer and the substrate resin layer using carbon dioxide gas laser.
A surface treated copper foil for a printed circuit board produced from a copper foil with one side roughened, wherein the copper foil is a surface treated copper foil for processing for laser hole formation and provided with a nickel layer with a thickness of 0.08 to 2.0 μm as an additional metal layer in one side and subjected to a nodular treatment by fine copper particles in another side.
A surface treated copper foil for a printed circuit board produced from a copper foil with one side roughened, wherein the copper foil is a surface treated copper foil for processing for laser hole formation and provided with a cobalt layer with a thickness of 0.05 to 3.0 μm as an additional metal layer in one side and subjected to a nodular treatment by fine copper particles in another side.
A surface treated copper foil for a printed circuit board produced from an electrodeposited copper foil obtained by electrolysis in a copper electrolytic solution and subjected to nodular treatment in one side, wherein the copper foil is a surface treated copper foil for processing for laser hole formation and provided with a nickel layer with a thickness of 0.05 to 2.0 μm as an additional metal layer in a matte side of the electrodeposited copper foil and subjected to a nodular treatment by fine copper particles in a shiny side.
A surface treated copper foil for a printed circuit board produced from an electrodeposited copper foil obtained by electrolysis in a copper electrolytic solution and subjected to nodular treatment in one side, wherein the copper foil is a surface treated copper foil for processing for laser hole formation and provided with a cobalt layer with a thickness of 0.03 to 3.0 μm as an additional metal layer in a matte side of the electrodeposited copper foil and subjected to a nodular treatment by fine copper particles in a shiny side.
An electrodeposited copper foil with carrier having a three-layer structure composed of a carrier foil layer, an additional metal layer, and an electrodeposited copper foil layer;
An electrodeposited copper foil with carrier having a three-layer structure composed of a carrier foil layer, an additional metal layer, and an electrodeposited copper foil layer;
An electrodeposited copper foil with carrier having a three-layer structure composed of a carrier foil layer, an additional metal layer, and an electrodeposited copper foil layer;
An electrodeposited copper foil with carrier having a three-layer structure composed of a carrier foil layer, an additional metal layer, and an electrodeposited copper foil layer;
An electrodeposited copper foil with carrier having a three-layer structure composed of a carrier foil layer, an additional metal layer, and an electrodeposited copper foil layer;
An electrodeposited copper foil with carrier having a three-layer structure composed of a carrier foil layer, an additional metal layer, and an electrodeposited copper foil layer;
An electrodeposited copper foil with carrier composed of a release layer formed on a surface of a carrier foil and an additional metal layer and an electrodeposited copper foil layer formed on the release layer, wherein the carrier foil is of a film or a metal material having a smooth surface with a roughness (Rz) of 0.05 to less than 4.0 μm, the release layer is formed using an organic agent or a metal material on the smooth face side of the carrier foil, a nickel layer with a thickness of 0.08 to 2.0 μm thickness is formed as the additional metal layer on a surface of the release layer, and the electrodeposited copper foil layer comprising a bulk layer and fine copper particles is formed in a surface of the additional metal layer to be an electrodeposited copper foil with carrier for processing for laser hole formation.
An electrodeposited copper foil with carrier composed of a release layer formed on a surface of a carrier foil and an additional metal layer and an electrodeposited copper foil layer formed on the release layer, wherein the carrier foil is of a film or a metal material having a smooth surface with a roughness (Rz) of 0.05 to less than 4.0 μm, the release layer is formed using an organic agent or a metal material on the smooth face side of the carrier foil, a cobalt layer with a thickness of 0.05 to 3.0 μm thickness is formed as the additional metal layer on a surface of the release layer, and the electrodeposited copper foil layer comprising a bulk layer and fine copper particles is formed in a surface of the additional metal layer to be an electrodeposited copper foil with carrier for processing for laser hole formation.
An electrodeposited copper foil with carrier composed of a release layer formed on a surface of a carrier foil and an additional metal layer and an electrodeposited copper foil layer formed on the release layer, wherein the carrier foil is of a film or a metal material having a smooth surface with a roughness (Rz) of 0.05 to less than 4.0 μm, the release layer is formed using an organic agent or a metal material on the smooth face side of the carrier foil, a nickel layer or a cobalt layer with a thickness of 0.03 to 1.0 μm thickness is formed as the additional metal layer on the surface of the release layer, and the electrodeposited copper foil layer comprising only fine copper particles is formed in the surface of the additional metal layer to be an electrodeposited copper foil with carrier for processing for laser hole formation.
An electrodeposited copper foil with carrier composed of a release layer formed on a surface of a carrier foil and an additional metal layer and an electrodeposited copper foil layer formed on the release layer, wherein the carrier foil is of a film or a metal material having a roughened face with a roughness (Rz) of 4.0 to 20.0 μm, the release layer is formed using an organic agent or a metal material on the roughened face side of the carrier foil, a nickel layer with a thickness of 0.05 to 2.0 μm thickness is formed as the additional metal layer on a surface of the release layer, and the electrodeposited copper foil layer comprising a bulk layer and fine copper particles is formed in the surface of the additional metal layer to be an electrodeposited copper foil with carrier for processing for laser hole formation.
An electrodeposited copper foil with carrier composed of a release layer formed on a surface of a carrier foil and an additional metal layer and an electrodeposited copper foil layer formed on the release layer, wherein the carrier foil is of a film or a metal material having a roughened face with a roughness (Rz) of 4.0 to 20.0 μm, the release layer is formed using an organic agent or a metal material on the roughened face side of the carrier foil, a cobalt layer with a thickness of 0.03 to 3.0 μm is formed as the additional metal layer on a surface of the release layer, and the electrodeposited copper foil layer comprising a bulk layer and fine copper particles is formed in a surface of the additional metal layer to be an electrodeposited copper foil with carrier for processing for laser hole formation.
An electrodeposited copper foil with carrier composed of a release layer formed on a surface of a carrier foil and an electrodeposited copper foil layer formed on the release layer, wherein the carrier foil is of a film or a metal material having a roughened face with a roughness (Rz) of 4.0 to 20.0 μm, the release layer is formed using an organic agent or a metal material on the roughened face side of the carrier foil, a nickel layer or a cobalt layer with a thickness of 0.03 to 1.0 μm thickness is formed as the additional metal layer on a surface of the release layer, and the electrodeposited copper foil layer comprising only fine copper particles is formed in a surface of the additional metal layer to be an electrodeposited copper foil with carrier for processing for laser hole formation.
A manufacturing method for an electrodeposited copper foil with carrier comprising steps of unwinding a carrier foil rolled in a roll state in one direction and subjecting the carrier foil to electrodeposited copper foil layer formation processes properly equipped with water-rinsing treatment tanks by passing the carrier foil respectively through an pickling tank, a release layer formation tank using an organic agent, a formation tank for forming a bulk copper layer to be the electrodeposited copper foil layer, a surface nodular treatment tank for forming fine copper particles on a surface of the bulk copper layer, an anti-corrosion treatment tank, and a drying part to continuously form the release layer of the organic agent and the electrodeposited copper foil layer on the carrier foil.
Dependencies are inferred from the claim text.