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US 2003/0148110 A1Published application
Paperboard substrate for blister packaging
AssigneeInternational Paper Company
InventorsVictor P. Holbert, David Reed
Life of this patent
Estimating the term…
Abstract
A packaging laminate comprising a paperboard substrate for providing a base layer, a tear-resistant polymer layer applied to said substrate, and a heat seal polymer layer applied to said tear-resistant polymer. This laminate structure is particularly useful for blister pack packaging.
Claims27
A blister pack laminate, comprising:
- a substrate for providing a base layer,
- a tear-resistant polymer layer applied to said substrate for providing child resistance, and
- a heat seal polymer layer applied to said tear-resistant polymer.
A blister pack laminate, comprising:
- a substrate for providing a base layer,
- a tear-resistant polymer layer blended with a heat seal polymer and applied to said substrate for providing both a child resistance and heat sealability.
A method of making a packaging substrate, comprising
- providing a substrate,
- applying a tear resistant polymer onto said substrate for providing child resistance, and
- applying a heat seal polymer onto said tear resistant polymer.
Dependencies are inferred from the claim text.