US 2003/0148107 A1 · Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board, prepreg, copper-clad laminate, printed wiring board, copper foil-attached resin film, carrier-attached resin film, build-up type laminate, and build-up type multi-layer board

Abstract

A halogen-free nonflammable epoxy resin composition, which comprises, as essential components (A) at least one kind of a cross-linked phenoxyphosphazene compound, (B) at least one kind of polyepoxide compound such as bisphenol A epoxy resin, (C) a curing agent for epoxy such as bisphenol A novolac resin, and (D) a cure promoter for epoxy, wherein the epoxy resin composition further comprises 0 to 50% by weight of an inorganic filler.

Claims18

Dependent claims

A halogen-free nonflammable epoxy resin composition, which comprises, as essential components:

(A) at least one kind of a cross-linked phenoxyphosphazene compound;
(B) at least one kind of polyepoxide compound;
(C) a curing agent for epoxy;
and
(D) a cure promoter for epoxy;
wherein said epoxy resin composition further comprises 0 to 50% by weight of an inorganic filler.

3 more elements

A halogen-free nonflammable epoxy resin composition for a build-up type multi-layer board, which comprises, as essential components:

(A) at least one kind of a cross-linked phosphazene compound;
(B) at least one kind of polyepoxide compound;
(C) a curing agent for epoxy;
(D) a cure promoter for epoxy;
and
(E) a thermoplastic resin or a thermosetting resin having a weight average molecular weight of 10,000 or more;
wherein the epoxy resin composition further comprises 0 to 50% by weight of an inorganic filler.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/337,488Filed 7 Jan 2003

Priority

JP 2000-21672618 Jul 2000

Published

7 Aug 2003

Term ends

Not estimatedThe source records don’t support an estimate.

Classification18 codes

H05K 3/4655
Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern: by using a laminate characterized by the insulating layer
B32B 15/08
Comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material: of synthetic resin
B32B 27/38
Layered products comprising a layer of synthetic resin: comprising epoxy resins
C08K 5/5399
Phosphorus-containing compounds: phosphorus bound to nitrogen

Life of this patent

Life of this patent

Abstract

Claims18