US 2003/0148079 A1 · Thermal conductive substrate and the method for manufacturing the same

Abstract

A thermal conductive substrate includes a first electrical insulator layer, a second electrical insulator layer and a lead frame serving as a circuit pattern. The first electrical insulator layer is formed of a thermal conductive resin composition containing a thermosetting resin and an inorganic filler, and is joined to the lead frame. The second electrical insulator layer is provided on the side of the first electrical insulator layer not in contact with the lead frame, and is formed of a thermal conductive resin composition containing the inorganic filler and a resin composition containing the thermosetting resin. The second electrical insulator layer has a higher thermal conductivity than the first electrical insulator layer. Thus, it is possible to achieve higher heat-radiating characteristics and component packaging reliability without deteriorating formability and adhesive characteristics of the electrical insulator layers.

Claims34

Dependent claims

A thermal conductive substrate comprising:

a first electrical insulator layer;
a second electrical insulator layer;
and
a lead frame serving as a circuit pattern;
wherein the first electrical insulator layer is formed of a thermal conductive resin composition comprising a thermosetting resin and an inorganic filler, and is joined to the lead frame,
the second electrical insulator layer is provided on a side of the first electrical insulator layer not in contact with the lead frame, and is formed of a thermal conductive resin composition comprising the inorganic filler and a resin composition comprising the thermosetting resin, and
the second electrical insulator layer has a higher thermal conductivity than the first electrical insulator layer.

4 more elements

A method for manufacturing a thermal conductive substrate comprising:

processing a first thermal conductive resin composition that has been produced by mixing an inorganic filler and a resin composition comprising a thermosetting resin that is not cured into a sheet;
producing a second thermal conductive resin composition having a higher thermal conductivity than the first thermal conductive resin composition by mixing the inorganic filler and the resin composition comprising the thermosetting resin that is not cured;
processing the second thermal conductive resin composition into a layer having a substantially constant thickness and adhering the layer onto a heat-radiating board;
and
stacking a lead frame, the first thermal conductive resin composition and the heat-radiating board provided with the second thermal conductive resin composition in this order so that the first and second thermal conductive resin compositions contact each other and integrating them by heating and pressing, as well as curing the thermosetting resin.

2 more elements

A method for manufacturing a thermal conductive substrate comprising:

processing a second thermal conductive resin composition produced by mixing an inorganic filler and a resin composition comprising a thermosetting resin that is not cured into a layer having a substantially constant thickness and adhering the layer onto a heat-radiating board;
processing a first thermal conductive resin composition produced by mixing the inorganic filler and the resin composition comprising the thermosetting resin that is not cured and having a lower thermal conductivity than the second thermal conductive resin composition into a layer having a substantially constant thickness, and adhering the layer onto the second thermal conductive resin composition that has been adhered onto the heat-radiating board in the first process;
and
stacking a lead frame and the heat-radiating board provided with the first and second thermal conductive resin compositions so that the lead frame and the first thermal conductive resin composition contact each other and integrating them by heating and pressing, as well as curing the thermosetting resin.

1 more element

Dependencies are inferred from the claim text.

Thermal conductive substrate and the method for manufacturing the same

Life of this patent

Thermal conductive substrate and the method for manufacturing the same

Life of this patent

Abstract

Claims34