Carrier plate for micro-hybrid circuits
OwnerUlrich Goebel, Elmar Huber +1inventors
InventorsULRICH GOEBEL, ELMAR HUBER, ALBERT-ANDREAS HOEBEL
Life of this patent
Estimating the term…
Abstract
The invention relates to a substrate board (2) for micro hybrid integrated circuits (7) having a ceramic body (3). According to the present invention, provision is made that the ceramic body (3) is a porous body, whose cavities are filled with aluminum. Due to the relatively small difference in thermal expansion coefficients of the substrate board (2) and the micro hybrid integrated circuit (7), a very good thermal bond of the micro hybrid integrated circuits (7) to the substrate board (2) is possible.
Claims6
A substrate board (2) for micro hybrid integrated circuits (7) having a porous ceramic body (3) having cavities, the cavities being infiltrated by a metallic substance and the ceramic body (3) being covered by a metallic skin (4),
- characterized in that the metallic skin (4) has one or more areas of reduced layer thickness, which form layout-specific depressions (5) for accommodating components (11) of the micro hybrid integrated circuits (7).
The substrate board as recited in one of the preceding claims,
- characterized in that the layer thickness of the areas is roughly 0.1 to 0.2 mm.
The substrate board as recited in one of the preceding claims,
- characterized in that the metal used is aluminum.
The substrate board as recited in one of the preceding claims,
- characterized in that it has at least one supplemental insulating layer (13) and/or at least one supplemental metallic layer (14).
Dependencies are inferred from the claim text.