Low viscosity precursor compositons and methods for the depositon of conductive electronic features

A metal precursor composition having a viscosity of not greater than about 1000 centipoise, comprising:

• (a) a silver metal compound;
• (b) silver particles;
• and
• (c) a conversion reaction inducing agent in amount sufficient to reduce the conversion temperature of said metal precursor composition by at least about 25° C. as compared to the dry silver metal compound, wherein said metal precursor composition has a conversion temperature of not greater than about 250° C.

A method for the fabrication of a conductive feature on a substrate, comprising the steps of:

• (a) providing a precursor composition comprising a silver metal precursor compound, wherein said precursor composition has a viscosity of not greater than about 50 centipoise and a surface tension of from about 20 to 50 dynes/cm;
• (b) depositing said precursor composition on a substrate;
• and
• (c) converting said precursor composition to a conductive feature by heating said precursor composition to a conversion temperature of not greater than about 250° C., wherein said conductive feature has a resistivity of not greater than about 10 times the resistivity of the pure bulk silver.

A method for the fabrication of a conductive feature on a substrate, comprising the steps of:

• (a) providing a precursor composition comprising a metal precursor compound, wherein said precursor composition has a viscosity of not greater than about 50 centipoise and a surface tension of from about 20 to 50 dynes/cm;
• (b) depositing said precursor composition on a substrate;
• and
• (c) converting said precursor composition to a conductive feature by heating said precursor composition to a conversion temperature of not greater than about 150° C., wherein said conductive feature has a resistivity of not greater than about 100 times the resistivity of the pure bulk metal.

A method for the fabrication of a conductive feature on a substrate, comprising the steps of:

• (a) providing a precursor composition comprising silver particles, wherein said precursor composition has a viscosity of not greater than about 50 centipoise and a surface tension of from about 20 to 50 dynes/cm;
• (b) depositing said precursor composition on a substrate;
• and
• (c) converting said precursor composition to a conductive feature by heating said precursor composition to a conversion temperature of not greater than about 150° C., wherein said conductive feature has a resistivity of not greater than about 100 times the resistivity of the pure bulk metal.

A method for the fabrication of an electronic device, comprising the steps of:

• (a) providing a substrate comprising at least a first non-linear element disposed on said substrate;
• (b) depositing a low viscosity metal precursor composition onto said substrate in the form of a trace contacting said first non-linear element, wherein said precursor trace has a minimum size of not greater than about 200μm;
• and
• (c) heating said deposited precursor composition to a temperature of not greater than about 200° C. to form a conductive feature electrically coupled to said first non-linear element, said conductive feature having a minimum feature size of not greater than about 200 μm and a resistivity of not greater than about 200 times the resistivity of the bulk metal.

A method for the fabrication of an electronic component, comprising the steps of:

• (a) depositing a low viscosity metal precursor composition onto said substrate in the form of a trace, wherein said precursor trace has a minimum size of not greater than about 200 μm;
• (b) heating said deposited precursor composition to a temperature of not greater than about 200° C. to form a conductive feature, said conductive feature having a minimum feature size of not greater than about 200 μm and a resistivity of not greater than about 200 times the resistivity of the bulk metal;
• and
• (c) depositing at least a first non-linear element on said substrate, wherein said conductive feature is electrically coupled to said first non-linear element.