Back to results
US 2003/0148019 A1Published application
Compositions and methods for forming dielectric layers using a colloid
OwnerByung Keun Hwang, Kermit Shannon Kwan +5inventors
InventorsByung Keun Hwang, Kermit Shannon Kwan, Zhongtao Li, Eric Scott Moyer, Sheng Wang, David Lee Wyman, Xiaobing Zhou
Life of this patent
Estimating the term…
Abstract
A colloid composition can be used to form a thin film on a substrate. The colloid can be colloidal silica. The thin film can be a dielectric layer. The substrate can be a semiconductor substrate having gaps thereon.
Claims37
A method comprising:
- i) depositing a composition on a substrate having a gap thereon, wherein the composition fills the gap and wherein the composition comprises
- a) a colloid,
- b) a vehicle comprising an organic solvent, water, or a combination thereof,
- with the proviso that when ingredient b) does not comprise an organic solvent, then the composition further comprises c) a surfactant, and optionally d) a stabilizer;
- and
- ii) curing the composition.
3 more elements
A method comprising:
- i) depositing a composition on a substrate, wherein the compostion comprises
- a) a capped colloidal silica,
- b) an organic solvent,
- optionally c) a surfactant,
- optionally d) a stabilizer, and
- optionally e) water;
- and
- ii) curing the composition.
5 more elements
A composition comprising:
- a) a capped colloidal silica,
- b) an organic solvent,
- optionally c) a surfactant,
- optionally d) a stabilizer, and
- optionally e) water;
- with the proviso that
- the composition has a composition surface tension less than a substrate surface tension of a substrate to which the composition will be applied.
4 more elements
Dependencies are inferred from the claim text.