Disk substrate, molding apparatus for injection-molding it and disk substrate pick-up robot

A mold apparatus for injection molding a disk substrate, comprising a cavity into which a molten resin is injected through a sprue and a recessed form gate, and a signal transfer stamper disposed on the fixed die side of said cavity, said mold apparatus comprising a projected portion for molding said recessed form gate provided at the tip of said sprue, a recessed portion for molding said recessed form gate provided oppositely to said projected portion at the tip of a recessed form gate cutter disposed on the movable die side, and a center hole molding portion provided at the outer circumference of said sprue.

A disk substrate taking-out apparatus comprising:

• a mold apparatus comprising a cavity provided between a fixed die and a movable die, a signal transfer stamper disposed on said fixed die side of said cavity, and a recessed form gate cutter disposed on said movable die side, wherein a molten resin is injected into said cavity through a sprue and a recessed form gate to injection molding a disk substrate, and gate cutting is conducted from said movable die side by said recessed form gate cutter;
• and
• a robot for taking out from said movable die said disk substrate released from said fixed die together with said movable die by the opening of said movable die after injection molding, said robot comprising a means for discharging a sprue and gate remaining resin to said movable die side relative to said disk substrate.