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US 2003/0147580 A1Published application
Packaging optically coupled integrated circuits using flip-chip methods
OwnerEugene Robert Worleyinventor
Life of this patent
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Abstract
Packaging methods suitable for optically linking two silicon chips together for the purpose of optical isolation are shown. These packaging methods rely on the integration of Light Emitting Diodes (LEDs) onto one or both of the silicon chips as well as silicon light detectors. The packaging methods include optically linking of side by side silicon chips and vertically stacked chips.
Claims27
An optical coupler, comprising:
- a first chip, comprising
- a substrate;
- a light emitter integrated onto the substrate;
- and
- a dielectric layer formed over the substrate;
- and
- a second chip having an integrated light detector;
- wherein the second chip is disposed on top of the dielectric layer of the first chip such that the light emitter of the first chip faces the light detector of the second chip.
5 more elements
An optical coupler, comprising:
- a first chip, comprising
- a substrate;
- a light detector integrated onto the substrate;
- and
- a dielectric layer formed over the substrate;
- and
- a second chip having an integrated light emitter;
- wherein the second chip is disposed on top of the dielectric layer of the first chip such that the light detector of the first chip faces the light emitter of the second chip.
5 more elements
An optical coupler, comprising:
- a first chip having an integrated light emitter
- a second chip having an integrated light detector, wherein the light emitter of the first chip faces the light detector of the second chip;
- and
- an optically transparent barrier plate interposed between the first and second chip.
1 more element
Dependencies are inferred from the claim text.