US 2003/0147436 A1 · Semiconductor laser device, method of fabricating the same, and optical pickup employing the same

Abstract

A semiconductor laser device that is suitable for mass production, that permits an improved wire layout, and that permits miniaturization includes leads disposed through each of two side faces of an insulating frame member so as to run from outside to inside the insulating frame member, an LD and a light-receiving element mounted inside the insulating frame member, and wires laid inside the insulating frame member so as to connect the leads to the electrodes of the LD and the light-receiving element. Inside the insulating frame member, the tip of one lead is extended farther inward than the edge of an element mount portion that faces the tip of another lead that is disposed through the same side face of the insulating frame member.

Claims20

Dependent claims

A semiconductor laser device including a plurality of leads disposed through each of two side faces of an insulating frame member so as to run from outside to inside the insulating frame member, at least a semiconductor laser element and a light-receiving element mounted inside or on the insulating frame member, and wires laid inside the insulating frame member so as to connect the leads to electrodes of the semiconductor laser element and the light-receiving element,

wherein, inside the insulating frame member, a tip of at least one of the leads is extended farther inward than an edge of an element mount portion that faces a tip of at least another of the leads that is disposed through a same side face of the insulating frame member as said at least one of the leads.

A method of fabricating a semiconductor laser device comprising:

a step of forming insulating frame members by molding a resin material on a lead frame made of a conductive material and having a plurality of leads connected together by a frame portion so as to obtain a plurality of would-be device portions connected together;
a step of fitting at least a semiconductor laser element and a light-receiving element to each of the would-be device portions to produce semiconductor laser devices still connected together;
a step of inspecting characteristics of the semiconductor laser devices by energizing the semiconductor laser devices with leads connected to element mount portions electrically insulated from other leads;
and
a step of cutting the lead frame so as to separate the individual semiconductor laser devices.

2 more elements

Dependencies are inferred from the claim text.

Semiconductor laser device, method of fabricating the same, and optical pickup employing the same

Life of this patent

Semiconductor laser device, method of fabricating the same, and optical pickup employing the same

Life of this patent

Abstract

Claims20