Multi-layered interconnect structure using liquid crystalline polymer dielectric

A method of making a multi-layered interconnect structure, comprising:

• providing a thermally conductive layer including first and second opposing surfaces;
• positioning a first liquid crystal polymer (LCP) dielectric layer on the first opposing surface of the thermally conductive layer, wherein the first LCP dielectric layer comprises a first LCP dielectric material, and wherein the first LCP dielectric layer includes a first LCP dielectric sublayer positioned on the first opposing surface of the thermally conductive layer;
• positioning a second LCP dielectric layer on the second opposing surface of the thermally conductive layer, wherein the second LCP dielectric layer comprises a second LCP dielectric material, and wherein the second LCP dielectric layer includes a second LCP dielectric sublayer positioned on the second opposing surface of the thermally conductive layer;
• and
• subjecting the first and second LCP dielectric layers to a first and second temperature that are less than the nematic-to-isotropic transition temperature of the first and second LCP dielectric materials, respectively, for a dwell time and at an elevated pressure that is sufficient to cause the first and second LCP dielectric materials to plastically deform and to cause:
• bonding of the first LCP dielectric sublayer to the thermally conductive layer without any extrinsic adhesive layer disposed between the first LCP dielectric sublayer and the thermally conductive layer, and bonding of the second LCP dielectric sublayer to the thermally conductive layer without any extrinsic adhesive layer disposed between the second LCP dielectric sublayer and the thermally conductive layer.

An electrical structure, comprising:

• a first 2S1P substructure, comprising a first dielectric layer, a first power plane within the first dielectric layer, a top signal plane on a top surface of the first dielectric layer, a bottom signal plane on a bottom surface of the first dielectric layer, and a first electrically conductive via;
• a second 2S1P substructure, comprising a second dielectric layer, a second power plane within the second dielectric layer, a top signal plane on a top surface of the second dielectric layer, a bottom signal plane on a bottom surface of the second dielectric layer, and a second electrically conductive via;
• and
• a joining layer having first and second opposing surfaces and an electrically conductive plug therethrough, wherein the joining layer comprises a liquid crystal polymer (LCP) dielectric material, wherein the first opposing surface of the joining layer is directly bonded to the first dielectric layer of the first 2S1P substructure with no extrinsic adhesive material bonding the joining layer to the first dielectric layer, wherein the second opposing surface of the joining layer is directly bonded to the second dielectric layer of the second 2S1P substructure with no extrinsic adhesive material bonding the joining layer to the second dielectric layer, and wherein the electrically conductive plug electrically couples the first electrically conductive via to the second electrically conductive via.

A method for forming an electrical structure, comprising:

• providing a first 2S1P substructure, said first 2S1P substructure comprising a first dielectric layer, a first power plane within the first dielectric layer, a top signal plane on a top surface of the first dielectric layer, a bottom signal plane on a bottom surface of the first dielectric layer, and a first electrically conductive via;
• providing a second 2S1P substructure, said second 2S1P substructure comprising a second dielectric layer, a second power plane within the second dielectric layer, a top signal plane on a top surface of the second dielectric layer, a bottom signal plane on a bottom surface of the second dielectric layer, and a second electrically conductive via;
• providing a joining layer, said joining layer having first and second opposing surfaces and an electrically conductive plug therethrough, wherein the joining layer comprises a liquid crystal polymer (LCP) dielectric material;
• and
• directly bonding the joining layer to the first dielectric layer of the first 2S1P substructure at the first opposing surface and to the second dielectric layer of the second 2S1P substructure at the second opposing surface, by subjecting the first 2S1P substructure, the joining layer, and the second 2S1P substructure to an elevated temperature, elevated pressure, and dwell time sufficient for effectuating said bonding, wherein the elevated temperature is less than the nematic-to-isotropic temperature of the LCP dielectric material during the dwell time, wherein no extrinsic adhesive material is disposed between the joining layer and the first dielectric layer, wherein no extrinsic adhesive material is disposed between the joining layer and the second dielectric layer, and wherein the electrically conductive plug electrically couples the first electrically conductive via to the second electrically conductive via.