US 2003/0147225 A1Published application

System including power conditioning modules

AssigneeCooligy, Inc.

InventorsThomas William Kenny JR., Kenneth E. Goodson, Juan G. Santiago, John J. Kim, Robert C. Chaplinsky, George Carl Everett JR.

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Abstract

In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.

Claims52

Dependent claims

A power conditioning and thermal management module to couple to an integrated circuit device, the power conditioning and thermal management module comprises:

a power conditioning element having a first interface and a second interface wherein the first interface opposes the second interface, the power conditioning element includes:
a semiconductor substrate;
a plurality of interface vias to provide electrical connection between the first interface and the second interface of the power conditioning element;
and
electrical circuitry, disposed in the semiconductor substrate, to condition the power to be applied to the integrated circuit device, wherein the electrical circuitry includes at least one voltage regulator and at least one capacitor;
and
a thermal management element having a first interface and a second interface wherein the first interface opposes the second interface, the thermal management element, during operation, uses a fluid having a liquid phase to capture thermal energy, the thermal management element including;
a substrate, wherein the substrate includes at least a portion of a micro channel disposed therein and configured to permit a flow of the fluid therethrough;
a plurality of interface vias to provide electrical connection between the first interface and the second interface of the thermal management element;
and
a pump, adapted to connect to the micro channel, to produce the flow of the fluid in the micro channel;
and
wherein each of the plurality of interface vias of the thermal management element connect to a corresponding one of the plurality of interface vias of the power management element to provide electrical connection between the first interface of the power conditioning element and the second interface of the thermal management element.

10 more elements

A power conditioning and thermal management module to couple to an integrated circuit device, the power conditioning and thermal management module having a first interface and a second interface wherein the first interface opposes the second interface, the power conditioning and thermal management module comprises:

a semiconductor substrate;
a plurality of interface vias to provide electrical connection between the first interface and the second interface;
a first plurality of pads disposed on the first interface, each of the first plurality of pads is connected to a corresponding one of the interface vias on the first interface;
a second plurality of pads disposed on the second interface, each of the second plurality of pads is connected to a corresponding one of the interface vias on the second interface;
and
electrical circuitry, disposed in the semiconductor substrate, to condition the power to be applied to the integrated circuit device, wherein the electrical circuitry includes at least one voltage regulator and at least one capacitor;
a micro channel structure, including at least one micro channel disposed in the semiconductor substrate, to capture thermal energy.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 10/114,005Filed 27 Mar 2002
Priority: 7 Feb 2002
Published: 7 Aug 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification12 codes

G06F 1/26
Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00: power supply means, e.g. regulation thereof
H10W 40/00
Arrangements for thermal protection or thermal control
H10W 40/47
Involving heat exchange by flowing fluids: by flowing liquids, e.g. forced water cooling
H10W 70/635
Vias, e.g. via plugs: through-vias

Family

Application10/072,137Division · filed 7 Feb 2002
Application10/114,005Division · filed 27 Mar 2002
US 6,606,251 B1Related patent
US 6,678,168 B2Related patent
US 2003/0147225 A1This patent

From the US filing history. Foreign family members aren’t listed.