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US 2003/0147215 A1Published application
Package with high heat dissipation
AssigneeMacronix International Co., Ltd.
InventorChun-Jen Weng
Life of this patent
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Abstract
A package with high heat dissipation, comprising a carrier and a chip located thereon, with electric connection between the chip to the carrier. A molding compound is used to encapsulate the chip, part of the carrier, and the connection between the chip and the carrier. A heat pipe is provided such that one end thereof is embedded in the molding compound, is close to the active surface of the chip and is substantially normal to the chip, and the other end thereof is extended outside of the molding compound.
Claims8
A package with high heat dissipation, comprising:
- a carrier;
- a chip located on the carrier;
- a molding compound encapsulating the chip and part of the carrier;
- and
- a heat pipe, wherein one end thereof is embedded in the molding compound at a location close to the active surface of the chip, and the other end thereof is extended outside of the molding compound.
2 more elements
Dependencies are inferred from the claim text.