Multilayer electronic part, multilayer antenna duplexer, and communication apparatus

A laminated electronic component comprising:

• a laminated body that integrates a plurality of laminated dielectric sheets;
• an inner circuit provided on the principal plane of a plurality of dielectric sheets within said laminated body;
• a grounding electrode provided on the principal plane of a plurality of dielectric sheets within said laminated body;
• a first via hole that penetrates the whole or part of said laminated body and electrically connects the grounding electrodes provided on the principal plane of said plurality of dielectric sheets;
• a second via hole that penetrates the whole or part of said laminated body and electrically connects the inner circuits provided on the principal plane of said plurality of dielectric sheets;
• and
• an input terminal and output terminal electrically connected to said second via hole,
• wherein at least one of said grounding electrodes is provided as an exposed grounding electrode which is exposed outside from the principal plane of the dielectric sheet in bottom layer and/or top layer of said dielectric layer, and
• said input electrode and said output electrode are provided on both sides of said exposed grounding electrode on the same plane as the plane on which said exposed grounding electrode is provided.

A laminated electronic component comprising:

• a dielectric layer A provided with a first shield electrode on one principal plane;
• a dielectric layer D whose at least one principal plane is exposed outside;
• a dielectric layer B which is placed between said dielectric layer A and said dielectric layer D and includes an inner circuit;
• and
• a first grounding electrode provided on the other principal plane of said dielectric layer A,
• wherein a via hole is provided in said dielectric layer A, and
• said first grounding electrode and said first shield electrode are electrically connected through said via hole provided on said dielectric layer A.