Electronic component and manufacturing method thereof
AssigneeTDK Corporation
InventorsMasashi Gotoh, Kouji Tashiro
Life of this patent
Estimating the term…
Abstract
In the case where an electrode conductor is formed on a principal plane of an element 10, a method including a step of forming an electrode conductor section 13 composed of a conductor pattern having a photosensitive conductive paste exposed and developed on the principal plane, and a step of forming an electrode conductor section 11 of a non-photosensitive conductive paste, wherein both electrode conductor sections 11, 13 are disposed on the surface of the element 10 so as to be at least partly contacted or overlapped with each other.
Claims11
The electronic component comprising:
- a first electrode conductor section formed of the non-photosensitive conductive paste on a surface connected with a principal surface, an end portion at the principal surface side being made taper shape;
- and
- a second electrode conductor section having the photosensitive conductive paste exposed and developed on said principal surface;
- wherein the end portion of the first electrode conductor section having a taper shape is overlapped at least a part of the second electrode conductor.
An electronic component comprising:
- a first electrode conductor section formed of said non-photosensitive conductive paste on a principal surface;
- and
- a second electrode conductor having said photosensitive conductive paste exposed and developed, and being at least partly overlapped on said first electrode conductor,
- wherein contours of the overlapped areas of both first and second electrode conductor sections being coincident.
An electronic component comprising:
- a first electrode conductor section having said photosensitive conductive paste exposed and developed, by which an electrode area is defined;
- and
- a second electrode conductor section formed of a non-photosensitive conductive paste, which is formed in the electrode area defined by said first electrode conductor section.
An electronic component comprising:
- a dielectric block;
- a first electrode conductor section having a photosensitive conductive paste exposed and developed on a principal surface of said dielectric block;
- and
- an inner peripheral electrode conductor section formed of a non-photosensitive conductive paste on an inner peripheral face of a through hole that is opened through said principal surface,
- wherein both electrode conductor sections are overlapped at least partly near an opening portion of said through hole on said principal plane to electrically conducts to make up a dielectric filter.
A method for manufacturing an electronic component comprising:
- the steps of:
- forming a first electrode conductor section of a non-photosensitive conductive pattern on a surface connected with a principal surface, an end portion at the principal surface side being made taper shape the other plane;
- forming a second electrode conductor section having a photosensitive conductive paste exposed and developed on said principal surface;
- wherein the end portion of the first electrode conductor section having a taper shape is overlapped at least a part of the second electrode conductor
A method for manufacturing the electronic component comprising the steps of:
- forming a first electrode conductor section of a non-photosensitive conductive pattern on a principal surface;
- forming a second electrode conductor section having a photosensitive conductive paste exposed and developed on said principal surface, the second electrode conductor section being at least partly overlapped on said first electrode conductor section;
- patterning said first electrode conductor section of the non-photosensitive conductive paste using said second electrode conductor section as a mask.
Dependencies are inferred from the claim text.