Method for correcting oscillation-induced imaging errors in an objective
AssigneeCarl Zeiss SMT GmbH
InventorsAlexander Kohl, Hubert Holderer
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AssigneeCarl Zeiss SMT GmbH
InventorsAlexander Kohl, Hubert Holderer
Estimating the term…
In a method for correcting oscillation-induced imaging errors in an objective, in particular a projection objective in microlithography for fabricating semiconductor elements, an at least first objective part and a second objective part are provided. In this case, the first objective part has a first optical axis and the second objective part has an optical axis which deviates from the first optical axis. Beam deflection takes place between the two objective parts via at least one optical beam deflection element. The oscillations occurring in the second objective part are measured and evaluated by means of a sensor system. The results are used as input data for a device, which adjusts the beam direction in the objective, in such a way that imaging errors occurring as a result of the oscillations of the second objective part are compensated for.
A method for correcting oscillation-induced imaging errors in an objective, the objective having at least one first objective part with a first optical axis and at least a second objective part whose optical axis deviates from said first optical axis, beam deflection taking place between the two objective parts via at least one optical beam deflection element, wherein oscillations occurring in at least one of said objective parts are measured and evaluated by means of a sensor system and wherein the results are used as input data for a device, which adjusts the beam direction in the objective, in such a way that imaging errors occurring as a result of the oscillations of the oscillating objective part are compensated for.
A method for correcting oscillation-induced imaging errors in a projection objective for microlithography for fabricating semiconductor elements, the objective having at least one first objective part with a first optical axis and at least a second objective part whose optical axis deviates from the first optical axis, beam deflection taking place between said two objective parts via at least one optical beam deflection element, wherein oscillations occurring in at least one of said objective parts are measured and evaluated by means of a sensor system and wherein the results are used as input data for a device, which adjusts the beam direction in the objective, in such a way that imaging errors occurring as a result of the oscillating objective part are compensated for.
A projection objective for microlithography for fabricating semiconductor elements, having at least one first objective part with a first vertical optical axis and having a second objective part whose optical axis deviates from the first vertical optical axis, an optical beam deflection element being arranged between the at least one first objective part and the second objective part, wherein the second objective part is provided with one or more sensors connected to an evaluation and control electronic unit, which is in turn connected to an adjusting element, which alters the position of the beam deflection element in accordance with the input data received.
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