Method and apparatus for position-dependent optical metrology calibration
AssigneeTokyo Electron Limited
InventorsAbdurrahman Sezginer, Kenneth Johnson, Adam E. Norton, Holger A. Tuitje
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AssigneeTokyo Electron Limited
InventorsAbdurrahman Sezginer, Kenneth Johnson, Adam E. Norton, Holger A. Tuitje
Estimating the term…
A calibration method suitable for highly precise and highly accurate surface metrology measurements is described. In preferred embodiments, an optical inspection tool including a movable optics system is characterized in terms of position and wavelength dependent quantities over a range of motion. Once the position-dependant quantities are determined at various wavelengths and positions, they are stored and used to interpret data from test wafers having an unknown metrology. Free of position-dependent variations and other information pertaining to the measurement system, the accuracy of the resulting wafer measurement more closely matches the precision of the tool than existing techniques. In particular embodiments, a portion of the characterization of the optical system is accomplished by using tilted black glass to provide a non-reflective reference.
A method of calibrating a wafer inspection tool, said wafer inspection tool including a polychromatic light source for generating a probe beam which illuminates a sample and a detector for measuring the probe beam after reflection from the sample, said inspection tool including an optics system for directing the probe beam onto the sample, with the optics system being moved over the wafer to scan measurement points on the wafer, said method comprising the steps of:
A method, comprising:
An apparatus, comprising:
A chuck for supporting a wafer to be measured by an optical metrology device, said chuck comprising:
A chuck for supporting a wafer to be measured by an optical metrology device, said chuck comprising:
A chuck for supporting a wafer to be measured by an optical metrology device, said chuck comprising:
A method of calibrating a wafer inspection tool, said wafer inspection tool including a light source for generating a probe beam which illuminates a sample, optics having a collection angle for receiving light emanating from the sample, and a detector for sensing light received from the sample, said method comprising the steps of:
An apparatus for use in conjunction with a wafer inspection tool including a light source for generating a probe beam which illuminates a sample, optics having a collection angle for receiving light emanating from the sample, and a detector for sensing light received from the sample, said apparatus comprising:
An apparatus for calibrating an optical metrology device, the optical metrology device including a light source for generating a probe beam which illuminates a sample, optics having a collection angle for receiving light emanating from the sample, and a detector for sensing light received from the sample, the apparatus comprising:
A method, comprising:
A computer readable storage medium storing instructions that, when executed by a computer processor, cause the computer to perform a method of calibration, the method comprising:
A chuck for supporting a wafer to be measured by an optical metrology device, said chuck comprising:
Dependencies are inferred from the claim text.