Flat panel detection type solid-state imaging device
AssigneeKabushiki Kaisha Toshiba
InventorsAkira Tsukamoto, Manabu Tanaka
Life of this patent
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Abstract
A TFT array structure formed on a glass substrate employs an aluminum alloy for the wiring patterns of signal lines and scanning lines. Besides, on the glass substrate, a terminal structure is formed near the terminating end of each of the wiring patterns. The terminal structure includes a terminal pattern which is formed of the same MoW layer as that of capacitor lines of the TFT array structure. Thus, the TFT array structure holds a repair facility equal to that of the prior art while realizing the enhancement of an operating speed and the reduction of image noise owing to the lowered resistances of the scanning lines and signal lines.
Claims15
A flat panel detection type solid-state imaging device, comprising:
- a flat substrate;
- an array structure which is formed on said flat substrate, and which includes a plurality of conversion pixels for converting incident light or an incident radiation into charges and then storing the charges, a first group of wiring patterns for feeding control signals to the conversion pixels, and a second group of wiring patterns for transferring charges read out from said conversion pixels;
- and
- terminal structures which are formed on said flat substrate, and each of which includes a terminal pattern for TAB (Tape Automated Bonding) connection which is connected with a terminating end of any of the wiring patterns of the first and second groups of wiring patterns;
- wherein a first material which couples more intensely than a second material of said wiring patterns in respect of the TAB connection is employed for the terminal patterns, and the second material of said wiring patterns has a resistance lower than that of the first material.
A flat panel detection type solid-state imaging device, comprising:
- a flat substrate;
- an array structure which is formed on said flat substrate, and which includes a plurality of conversion pixels for converting incident light or an incident radiation into charges and then storing the charges, a first group of wiring patterns for feeding control signals to the conversion pixels, and a second group of wiring patterns for transferring charges read out from said conversion pixels;
- and
- terminal structures which are formed on said flat substrate, and each of which includes a terminal pattern for TAB (Tape Automated Bonding) connection as is formed at a position near a terminating end of any of the wiring patterns of the first and second groups of wiring patterns;
- and
- connection structures which are formed on said flat substrate, and each of which includes a conductive pattern that is stacked on an end part of said terminal pattern and the terminating end of the wiring pattern so as to overlap them partially, and that serves to electrically connect both said terminal pattern and said wiring portion;
- wherein a first material which couples more intensely than a second material of said wiring patterns in respect of the TAB connection is employed for the terminal patterns, and the second material of said wiring patterns has a resistance lower than that of the first material.
Dependencies are inferred from the claim text.