Design structures of and simplified methods for forming field emission microtip electron emitters
AssigneeIntel Corporation
InventorsMichael A. Maxim, Oleh Karpenko, Farshid Adibi-rizi, Brett E. Huff
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AssigneeIntel Corporation
InventorsMichael A. Maxim, Oleh Karpenko, Farshid Adibi-rizi, Brett E. Huff
Estimating the term…
Electron emission structures formed using standard semiconductor processes on a substrate first prepared with a topographical feature are disclosed. At least one layer of a first material is concurrently deposited on the substrate and etched from the substrate to form an atomically sharp feature. An at least one layer of a second material is deposited over the atomically sharp feature. A conductive layer is deposited over the at least one layer of the second material. A selected area of material is removed from the conductive layer and the at least one layer of second material to expose the atomically sharp feature. Finally, electrical connectivity is provided to elements of the electron emission structure.
A method for constructing electron emission structures, the method comprising:
An electron emission structure comprising:
A device incorporating electron emission structures, the device comprising:
Dependencies are inferred from the claim text.