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US 2003/0146521 A1Published application
Die-attaching paste and semiconductor device
AssigneeSumitomo Bakelite Co., Ltd.
InventorsNobuki Tanaka, Hikaru Okubo, Ryuichi Murayama, Kazuto Onami, Tomohiro Kagimoto
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Abstract
The present invention provides a die-attaching paste superior in solder cracking resistance, used for bonding of semiconductor chips. The present invention lies in a die-attaching paste comprising as essential components: (A) a hydrocarbon having a number-average molecular weight of 500 to 5,000 and at least one double bond in the molecule, or its derivative, (B) a reactive diluent, (C) a radical polymerization catalyst, and (D) a filler.
Claims12
(Amended) A die-attaching paste comprising as essential components:
- (A) a hydrocarbon having a number-average molecular weight of 500 to 5,000 and at least one double bond in the molecule, or its derivative, said hydrocarbon or its derivative consisting of
- (A1) a combination of a compound obtained by a reaction between a maleinized polybutadiene and a (meth)acrylic acid/aliphatic dialcohol ester, and an epoxidized polybutadiene,
- (A2) a polybutadiene having acrylic or methacrylic group at the two terminals, or
- (A3) a combination of an acrylic or methacrylic group-containing polybutadiene which is liquid at room temperature and an epoxidized polybutadiene,
- (B) a reactive diluent,
- (C) a radical polymerization catalyst, and
- (D) a filler.
4 more elements
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Dependencies are inferred from the claim text.