Flip-chip package with a heat spreader

Abstract

A flip-chip package with a heat spreader includes a substrate, a chip, a heat spreader, multiple first bumps, multiple second bumps, a first fill material and a second fill material. The substrate has multiple conductive nodes formed on a surface thereof. The chip has an active surface and a corresponding backside surface. The chip further has multiple conductive pads formed on the active surface. The chip is placed over the substrate, the active surface of the chip facing the surface of the substrate. The heat spreader having a cavity is placed on the substrate, wherein the cavity of the heat spreader faces the substrate and the chip is located inside the cavity. The first bumps are placed between the conductive pads of the chip and the conductive nodes of the substrate. The second bumps are placed between the backside surface of the chip and the heat spreader. The first fill material is filled between the chip and the substrate and covers the first bumps. The second fill material is filled in the cavity of the heat spreader and covers the chip and the second bumps.

Dependencies are inferred from the claim text.